Interconnectable Tiling System

ABSTRACT

A tile system for covering a surface. The tile system comprises a first tile assembly connected to a second tile assembly by a connector. Each tile assembly comprises a first tile stacked on a second tile, the first tile and the second tile joined to a reinforcing material disposed therebetween. The connector comprises a first component and a second component that is complementary to the first component. The first component is mounted to the first tile assembly, and the second component is mounted to the second tile assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/906,912 filed Jun. 19, 2020, which is a continuation of InternationalPCT Application No. PCT/CA2018/051635 filed Dec. 20, 2018, which claimsthe benefit of U.S. Provisional Patent Application No. 62/609,561, filedDec. 22, 2017, all of which are incorporated herein by reference intheir entireties.

FIELD

This relates to the field of tiling, and in particular, a tile systemhaving a plurality of tiling assemblies connected together withreleasable connectors.

BACKGROUND

Tiles may be installed on a surface of a room, such as the floor or awall, for functional or aesthetic reasons. Without tiling, it may beunsafe to walk on a floor, which may have an uneven or splinteredsurface. Tiles may be installed to protect the underlying surface fromvarious damage and wear (e.g. from liquids and impact). The exposedsurface of the tile may have a decorative feature, such as colours,patterns, or designs, which increase the aesthetic appeal of the surfaceupon which the tile is installed.

Unfortunately, existing processes for installing tiles may be costly,labour-intensive, and require the skill and experience of a trained tileinstaller.

Prior to installing tiles on the surface, the surface may first need tobe prepared, such as by cleaning the surface, installing a mesh framesubfloor, and/or applying a layer of mortar to the surface. Installingthe tiles may itself be a delicate task. When the tiles are laid down onthe surface, adjacent tiles may need to be level and even; otherwise,the raised edges and corners of uneven tiles may provide discomfort orbe a safety hazard to those walking on the tiled surface, and tiles thatare misaligned or improperly spaced may be aesthetically displeasing.After the tiles are laid down, the tiled surface may need furthertreatment, such as the application of grout, which may be cumbersome andtime-consuming.

Moreover, it may be difficult to replace installed tiles. It may betedious and messy to remove the installed tiles, which may dislodgehardened mortar and grout, generate dust, and damage the underlyingsurface. Because the installed tiles are secured to the same surface, itmay be difficult to replace only some of the installed tiles withoutdamaging other tiles.

In addition, existing processes for installing tiles may beenvironmentally unfriendly. In particular, damaged tiles may not bereused, and new tiles need to be manufactured to replace the damagedtiles. Further, water, cement, and sand may be required to preparesufficient amounts of mortar and grout each time tiles are installed, asit may not be feasible to reuse hardened mortar and grout.

SUMMARY

According to one aspect, there is provided a tile system forinstallation on a free floating basis to form a surface covering on asubstrate without bonding the tile assembly to the substrate, the tilesystem comprising: a first tile assembly configured for detachableconnection to a second tile assembly, each of the first and second tileassemblies comprising: a first tile stacked on a second tile, the firsttile and the second tile bonded to a layer of stabilizing materialdisposed between the first and second tiles; wherein the first tileassembly further comprises a first attachment component comprising atleast one magnetic element, and the second tile assembly furthercomprises a second attachment component comprising at least one magneticcomplementary to the magnetic element of the first attachment component,second attachment component being complementary in shape to the firstattachment component and configured to receive the first attachmentcomponent to form a detachable connection between the first tileassembly and the second tile assembly, the detachable connection havinga mechanical resistive force and a magnetic force attracting the firstand second tile assemblies.

According to another aspect, there is provided a tile system forcovering a surface, comprising: a first tile assembly configured fordetachable connection to a second tile assembly, each tile assemblycomprising: a first tile stacked on a second tile, the first tile andthe second tile joined to a stabilizing material disposed therebetween;wherein the first tile assembly further comprises a first attachmentcomponent, and the second tile assembly further comprises a secondattachment component, the second attachment component beingcomplementary in shape to the first attachment component.

In some embodiments, the first tile and the second tile are ceramictiles.

In some embodiments, the first attachment component and the secondattachment component are engaged in a friction fit when the first andsecond tile assemblies are connected.

In some embodiments, the first attachment component is disposed on twoadjoining sides of the first tile assembly, and the second attachmentcomponent is disposed on two adjoining sides of the second tileassembly.

In some embodiments, the first attachment component is disposed on twoopposite sides of the first tile assembly, and the second attachmentcomponent is disposed on two opposite sides of the second tile assembly.

In some embodiments, the first attachment component is disposed on allsides of the first tile assembly.

In some embodiments, the second attachment component is disposed on allsides of the second tile assembly.

In some embodiments, the first attachment component is a hook, and thesecond attachment component is a loop.

In some embodiments, each of the first and second attachment componentshas at least one magnetic element disposed therein.

In some embodiments, each of the first and second attachment componentsis a magnet.

In some embodiments, the first attachment component is a tongue and thesecond attachment component is a groove.

In some embodiments, first attachment component is formed from a polymermaterial.

In some embodiments, the reinforcing material is an orthotropic glassfiber material.

In some embodiments, an exposed surface of the first tile of the firsttile assembly and an exposed surface of the first tile of the secondtile assembly are substantially level.

In some embodiments, the tile system comprises a foam pad joined to anexposed surface of the second tile of the first tile assembly.

In some embodiments, the first tile assembly and second tile assemblydefine a gap therebetween.

In some embodiments, the gap is approximately 3/16″.

In some embodiments, the second tile of the first tile assembly has afirst coupling surface for releasably mounting the first and second tileassemblies to a second coupling surface complementary to the firstcoupling surface.

In some embodiments, the first coupling surface has loops.

In some embodiments, the second coupling surface has hooks.

In some embodiments, the first tile has one of a triangular,rectangular, or hexagonal shape.

In some embodiments, the first tile has a polygonal shape.

In some embodiments, the connection between the first and second tileassembly is waterproof.

In some embodiments, the first attachment component is malleable.

According to another aspect, there is provided a tile assembly forinstallation on a free floating basis to form a surface covering on asubstrate without bonding the tile assembly to the substrate, the tileassembly comprising: an exterior facing tile having a plurality ofsides; a first attachment component disposed on at least a first side ofthe plurality of sides; and a second attachment component disposed on atleast a second side of the plurality of sides; wherein the firstattachment component is configured to engage with a corresponding secondattachment component on an adjacent tile, and wherein the secondattachment component is configured to engage with a corresponding firstattachment component on the adjacent tile.

In some embodiments, the tile assembly further comprises a layer ofstabilizing material disposed on an underside of the exterior facingtile.

In some embodiments, the tile assembly further comprises an interiorfacing tile disposed on the layer of stabilizing material.

In some embodiments, the stabilizing material is one of fiberglass,steel, or aluminum.

In some embodiments, the tile assembly further comprises a layer ofsound-absorbing material.

In some embodiments, the sound-absorbing material is cork.

In some embodiments, the first and second attachment components aremalleable.

In some embodiments, the tile assembly is resistant to one or more ofrolling loads, high impacts, static loads, and shifting and/or settlingof the substrate.

In some embodiments, the first and second attachments have one or moremagnetic elements disposed therein.

In some embodiments, the first and second attachments form a hook andloop configuration.

In some embodiments, the first and second attachments form a click andlock configuration.

According to another aspect, there is provided a tile assembly forinstallation on a free floating basis to form a surface covering on asubstrate without bonding the tile assembly to the substrate, the tileassembly comprising: a first tile; a second tile; a layer of stabilizingmaterial disposed between the first tile and the second tile; and aplate having a recess configured to accept at least one of the firsttile and the second tile, said plate comprising: a first attachmentcomponent disposed on at least a first side of said plate, and a secondattachment component disposed on at least a second side of said plate,wherein the first attachment component is configured to engage with acorresponding second attachment component on an adjacent plate, andwherein the second attachment component is configured to engage with acorresponding first attachment component on the adjacent plate.

In some embodiments, the tile assembly further comprises a grout forsealing connections between adjacent plates.

According to another aspect, there is provided a tile assembly forinstallation on a free floating basis to form a surface covering on asubstrate without bonding the tile assembly to the substrate, the tileassembly comprising: a first tile; a second tile; a layer of stabilizingmaterial disposed between the first tile and the second tile; and a trayhaving a recess configured to accept at least one of the first tile andthe second tile, said plate comprising: a first attachment componentdisposed on at least a first side of said tray, and a second attachmentcomponent disposed on at least a second side of said tray, wherein thefirst attachment component is configured to engage with a correspondingsecond attachment component on an adjacent tray, and wherein the secondattachment component is configured to engage with a corresponding firstattachment component on the adjacent tray, and wherein the first andsecond attachment components further include an artificial grout.

According to another aspect, there is provided a connector forconnecting a first tile having a plurality of sides to at least a secondtile, the grout connector comprising: a plurality of inner faces, eachinner face having a shape complementary in shape to a respective side ofthe plurality of sides of the first tile; at least one first attachmentcomponent disposed on an opposite side of at least one of the innerfaces; at least one second attachment component disposed on an oppositeside of at least another one of the inner faces; wherein the firstattachment component is configured to engage with a corresponding secondattachment component of an adjacent grout connector, and wherein thesecond attachment component is configured to engage with a correspondingfirst attachment component on the adjacent connector.

In some embodiments, the connector further comprises a recess foraccepting the first tile.

In some embodiments, the connector is bonded to the first tile withadhesive.

In some embodiments, a connection between the first and secondattachment components with the adjacent connector is waterproof.

In some embodiments, the first and second attachment components includeat least one of a tongue and groove connection, or a click and lockconnection.

In some embodiments, the first and second attachment components compriseat least one magnetic element for strengthening the connection betweenthe connector and the adjacent connector when connected.

According to another aspect, there is provided a method of manufacturinga tile assembly, the method comprising: joining a first tile to a layerof reinforcing material; and applying pressure to the first tile and thelayer of reinforcing material.

In some embodiments, the method further comprises: joining a second tileto the layer of reinforcing material.

In some embodiments, the method further comprises: joining a soundproofmaterial to the second tile.

In some embodiments, the method further comprises: joining a firstattachment component to a first side of the first tile; and joining asecond attachment component to a second side of the first tile.

In some embodiments, the method further comprises placing one or more ofthe first tile and the layer of reinforcing material into a tray orplate having a recess dimensioned to accept the one or more of the firsttile and the layer of reinforcing material.

In some embodiments, the method further comprises bonding thereinforcing material to the tray or plate.

In some embodiments, the method further comprises placing one or more ofthe first tile, second tile, and reinforcing material into a tray orplate having a recess dimensioned to accept the one or more of the firsttile, second tile, and reinforcing material.

In some embodiments, the method further comprises bonding the secondtile to the tray or plate.

In some embodiments, the first and second attachment components includeat least one of a tongue and groove connection, or a click and lockconnection.

In some embodiments, the first and second attachment components includeat least one magnetic element.

According to another aspect, there is provided a method of covering asubstrate with interlocking tile assemblies without bonding theinterlocking tile assemblies to the substrate, the method comprising:engaging a first attachment feature of a first tile assembly with asecond attachment feature of a second tile assembly, the firstattachment component being complementary in shape to the secondattachment component; and engaging a second attachment feature of thefirst tile assembly with a first attachment feature of the second tileassembly.

In some embodiments, the first and second tile assemblies comprise afirst tile and a layer of stabilizing material on an underside of thefirst tile.

In some embodiments, the first and second attachment components includeat least one of a tongue and groove connection, or a click and lockconnection.

In some embodiments, the first and second attachment components includeat least one magnetic element.

In some embodiments, an exposed surface of the first tile assembly andan exposed surface of the second tile assembly are substantially level.

In some embodiments, the method further comprises defining a gap betweenthe first tile assembly and the second tile assembly upon connecting thefirst tile assembly with the second tile assembly.

In some embodiments, the gap is approximately 3/16″.

In some embodiments, the method further comprises: mounting the tilingassembly to the substrate by connecting a first coupling surface of thefirst tile assembly to a second coupling surface of the substrate, thesecond coupling surface being complementary in shape to the firstcoupling surface.

In some embodiments, the first coupling surface has loops.

In some embodiments, the second coupling surface has hooks.

According to another aspect, there is provided a reinforced tileassembly, the tile assembly comprising: a first tile; a second tile; anda layer of stabilizing material disposed between the first and secondtiles.

In some embodiments, the first tile has a plurality of sides, and thetile assembly further comprises a first attachment component disposed onat least a first side of the plurality of sides, and a second attachmentcomponent disposed on at least a second side of the plurality of sides,wherein the first attachment component is configured to engage with acorresponding second attachment component on an adjacent tile assembly,and wherein the second attachment component is configured to engage witha corresponding first attachment component on the adjacent tileassembly.

In some embodiments, the stabilizing material is one of fiberglass,polyethylene terephthalate, steel, aluminum, or foam.

According to another aspect, there is provided a tile system forcovering a surface, comprising: a first tile assembly connected to asecond tile assembly by a connector, each tile assembly comprising afirst tile stacked on a second tile, the first tile and the second tilejoined to a reinforcing material disposed therebetween; wherein theconnector comprises a first component and a second component that iscomplementary to the first component; the first component is mounted tothe first tile assembly, and the second component is mounted to thesecond tile assembly.

In some embodiments, the first tile and the second tile are ceramictiles.

In some embodiments, a side of the first tile assembly having the firstcomponent is opposite a side of the second tile assembly having thesecond component when the first tile assembly and the second tileassembly are connected.

In some embodiments, the first tile assembly has the first component ontwo adjoining sides of the first tile assembly, and the second tileassembly has the second component on two adjoining sides of the secondtile assembly.

In some embodiments, the first tile assembly has the first component ontwo opposite sides of the first tile assembly, and second tile assemblyhas the second component on two opposite sides of the second tileassembly.

In some embodiments, the first tile assembly has the first component onall sides of the first tile assembly.

In some embodiments, the second tile assembly has the second componenton all sides of the second tile assembly.

In some embodiments, the first component of the connector is a hook, andthe second component of the connector is a groove.

In some embodiments, the first component of the connector is a tongueand the second component of the connector is a channel.

In some embodiments, the connector is formed from a polymer material.

In some embodiments, the reinforcing material is an orthotropic glassfiber material.

In some embodiments, an exposed surface of the first tile of the firsttile assembly and an exposed surface of the first tile of the secondtile assembly are level.

In some embodiments, the tile system comprises a foam pad joined to anexposed surface of the second tile of the first tile assembly.

In some embodiments, the first tile assembly and second tile assemblydefine a gap therebetween.

In some embodiments, the gap is approximately 3/16″.

In some embodiments, the second tile of the first tile assembly has afirst coupling surface for releasably mounting the first and second tileassemblies to a second coupling surface complementary to the firstcoupling surface.

In some embodiments, the first coupling surface has loops.

In some embodiments, the second coupling surface has hooks.

In accordance with another aspect, there is provided a method ofcovering a surface, the method comprising: joining pairs of first tilesand second tiles to reinforcing material disposed therebetween, thefirst tiles stacked on the second tiles, to define a first tile assemblyand a second tile assembly; and connecting the first tile assembly withthe second tile assembly with a connector to define a tiling system, theconnector having a first component and a second component that iscomplementary to the first component, wherein the first tile assemblyhas the first component and the second tile assembly has the secondcomponent.

In some embodiments, the first tile and the second tile are ceramictiles.

In some embodiments, a side of the first tile assembly having the firstcomponent is opposite a side of the second tile assembly having thesecond component when the first tile assembly and the second tileassembly are connected.

In some embodiments, an exposed surface of the first tile of the firsttile assembly and an exposed surface of the first tile of the secondtile assembly are level.

In some embodiments, the method comprises defining a gap between thefirst tile assembly and the second tile assembly upon connecting thefirst tile assembly with the second tile assembly.

In some embodiments, the gap is approximately 3/16″.

In some embodiments, the method comprises: mounting the tiling assemblyto the surface by connecting a first coupling surface of the first tileassembly to a second coupling surface of the surface, the secondcoupling surface complementary to the first coupling surface.

In some embodiments, the first coupling surface has loops.

In some embodiments, the second coupling surface has hooks.

BRIEF DESCRIPTION OF DRAWINGS

In the figures which illustrate example embodiments,

FIGS. 1A, 1B and 1C are a schematic of a tile assembly;

FIGS. 2A, 2B and 2C are a schematic of the tile assembly of FIG. 1 withanother attachment feature;

FIGS. 3A, 3B, 3C and 3D are a schematic of the tile assembly of FIG. 1with another attachment feature;

FIG. 4 is a schematic of a cross-sectional view of a tile system;

FIG. 5 is a schematic of a cross-sectional view of a tile system;

FIG. 6 is a schematic of the edges of a tile;

FIG. 7 is a schematic of the attachment feature of the tile;

FIG. 8 is a schematic of an attachment feature of the tile assembly;

FIG. 9 is a schematic of an attachment feature of the tile assembly;

FIG. 10 is a schematic of an example male attachment feature and anexample female attachment feature;

FIG. 11 is a schematic of an example male attachment feature and anexample female attachment feature connected together;

FIG. 12A is a schematic of another attachment feature of the tileassembly;

FIG. 12B is a schematic of another attachment feature of an exampleembodiment of a tile assembly;

FIG. 13 is a schematic of another attachment feature of the tileassembly;

FIG. 14 and FIG. 15 are schematics of another attachment feature of thetile assembly;

FIG. 16 is a schematic of another attachment feature of the tileassembly;

FIG. 17 is a schematic of other example attachment features of the tileassembly;

FIG. 18 is a schematic of another attachment feature of the tileassembly;

FIG. 19 is a schematic of another attachment feature of the tileassembly;

FIG. 20 is a schematic of two tile assemblies connected together withattachment features;

FIG. 21 is a schematic of the male attachment feature of FIG. 20 ;

FIG. 22 is a schematic of attachment features connecting two tileassemblies together;

FIG. 23 is a schematic of a tile system formed from four tileassemblies;

FIG. 24 is a schematic of two tile assemblies joined together withattachment features;

FIG. 25 is a schematic of a tile assembly having an attachment feature;

FIG. 26 is a schematic of a tile assembly having an attachment feature;

FIG. 27 is a schematic of a tile assembly;

FIG. 28 is a schematic of a tile assembly having a male attachmentfeature that is connected with a female attachment feature;

FIG. 29 is a schematic of two tile assemblies connected together by amale attachment feature and a female attachment feature to form a tilesystem;

FIGS. 30-34 depict the tile assemblies of FIG. 29 separated from eachother;

FIG. 35 is a schematic of attaching a tile assembly to another tileassembly to form a tile system;

FIG. 36 is a schematic of attaching a tile assembly to another tileassembly to form a tile system;

FIG. 37 is a schematic of attaching a tile assembly to another tileassembly to form a tile system;

FIG. 38 is a schematic of a tile system;

FIG. 39 is a schematic of attaching a tile assembly to another tileassembly to form a tile system;

FIG. 40 is a schematic of a tile assembly having two tiles;

FIG. 41 is a schematic of two tile assemblies having two tiles connectedtogether;

FIG. 42 is two exploded views of a tile assembly having two tiles;

FIG. 43 is a schematic of two tile assemblies having two tiles, withstabilizers connected to the tile assemblies;

FIG. 44 is a schematic of a tile system having nine tiling assembliesconnected together;

FIG. 45 is a schematic of two tile assemblies having two tiles, withloops connected to the tile assemblies;

FIG. 46 is a schematic of a tile assembly manufactured with thestabilizer moulded to a tile;

FIG. 47 is a schematic of a tile assembly manufacturing tool;

FIG. 48 is a schematic of the tile assembly manufacturing tool of FIG.47 ;

FIG. 49 is a schematic of a tile assembly being manufactured by the toolof FIG. 47 ;

FIG. 50 is a schematic of a temperature plot of the plastic and the toolduring the tile assembly manufacturing process;

FIG. 51 is a schematic of a moulding backing plate for manufacturing atile assembly;

FIG. 52 is a schematic of a tile for manufacturing a tile assembly;

FIG. 53 is a schematic of press welding a tile and a backing plate formanufacturing a tile assembly;

FIG. 54 is a schematic of a manufactured tile assembly;

FIG. 55 is a table outlining features of an injection moulding process,variotherm process, and press welding process;

FIG. 56 is a schematic of a tile and a backing plate being press weldedtogether to form a tile assembly;

FIG. 57 is a schematic of cams of a tile assembly manufacturing tool;

FIG. 58 is a schematic of a press-welded tile assembly;

FIGS. 59-63 are schematics of press-welded tile assemblies;

FIG. 64 is a schematic of a press-welded tile assembly;

FIG. 65 is a schematic of a tile assembly with a tile, a stabilizer, anda female attachment feature;

FIG. 66 is a schematic of a mount assembly;

FIG. 67 is a schematic of plates of a mount assembly;

FIG. 68 is a schematic of mount assemblies with plates installedhorizontally and vertically;

FIG. 69 is a schematic of mount assemblies with plates installedhorizontally and vertically;

FIG. 70 is a schematic of mount assemblies with plates installedhorizontally and vertically;

FIG. 71 is a schematic of a plate of a mount assembly;

FIG. 72 is a schematic of a joining component of the mount assembly;

FIGS. 73-74 are schematics of a joining component of the mount assembly;

FIG. 75 is a schematic of a joining component of the mount assembly;

FIG. 76 is a schematic of a mount assembly with the plates and joiningcomponents assembled together;

FIG. 77 is a schematic of a mount assembly with gaps on the plates;

FIG. 78 is a schematic of a mount assembly;

FIG. 79 is a schematic of a mount assembly;

FIG. 80 is a schematic of a mount assembly;

FIG. 81 is a schematic of a mount assembly being assembled;

FIG. 82 is a schematic of a mount assembly being assembled;

FIG. 83 is a schematic of a corner of a plate of a mount assembly;

FIG. 84 is a schematic of a corner of a plate of a mount assembly;

FIG. 85 is a schematic of a plate of a mount assembly;

FIG. 86 is a schematic of a mount assembly having another attachmentfeature;

FIG. 87 is a schematic of a plurality of plates and joining componentsof a mount assembly;

FIGS. 88-92 are schematics of another attachment feature of a plate of amount assembly;

FIGS. 93-95 are schematics of assembling a mount assembly;

FIGS. 96-97 are schematics of a mount assembly having another attachmentfeature;

FIGS. 98-101 are schematics of attachment features of mount assemblies;

FIG. 102 is a schematic of another plate of the mount assembly;

FIG. 103 is a schematic of four plates of a mount assembly connected byjoining components;

FIG. 104 is a schematic of a plate of a mount assembly having recessesand through-holes;

FIG. 105 is a schematic of plates of the mount assembly;

FIGS. 106-109 are schematics of mounting a mount assembly to a surface;

FIG. 110 is a schematic of mounting a tile system to a mount assembly;

FIG. 111 is a schematic of a wall for mounting the mount assembly;

FIG. 112 is a flow chart depicting a method for assembling and using atile system to cover a surface;

FIG. 113 is a flow chart depicting a method for mounting a tile systemto a surface using a mount assembly;

FIG. 114 is a schematic of telegraphing on a floor when using roll-outvinyl;

FIG. 115 is a schematic of a round object on a tile assembly;

FIG. 116 is a schematic of a corner of a tile;

FIG. 117 is a schematic of a tile assembly; and

FIG. 118 is a schematic of an example embodiment of a tile assembly.

DETAILED DESCRIPTION

A tile assembly and a tile system are disclosed. The tile assembly maycomprise a first tile. The bottom surface of the tile may be joined witha stabilizer for laying the tile assembly on a floor. The tile assemblymay comprise connectors having attachment features on the sides of thetile. The attachment features may be integrally formed with thestabilizer or may be separately joined to the tile. The attachmentfeatures may be complementary to one another, such that tile assembliesmay be joined together to form a tile system. The tile system maycomprise two tiles, with a fibre glass stabilizer between the two tiles.The tile system may be used to cover a surface, such as a floor. Thetile system may be laid down on the floor without having to use mortarto join the tile system to the floor. Accordingly, the tile system may“free float” and self-level when installed on the floor. Further, thetile system may be mounted to a wall to cover the wall. A mount assemblycomprising plates and discs may be mounted to a surface, such as thewall, such that the tile system may be mounted to the mount assembly tocover the surface. The tile assembly may be used as a subsurface or as asurface.

FIG. 1 is a schematic of a tile assembly 100. The tile assembly 100comprises a tile 102 and a stabilizer 104. As depicted in FIG. 1 , thestabilizer 104 is joined to a bottom surface of the tile 102, such thatthe top surface is exposed when installed on a surface, such as a flooror a wall. The stabilizer 104 may be joined to the tile 102 usingmoulding (e.g. injection moulding), welding (e.g. press welding,ultrasonic welding, vibration welding, contact welding), adhesive, andthe like. When laid on the floor, the stabilizer 104 of the tileassembly 100 may contact one or more points of the floor.

The tile assembly 100 may have different shapes. For example, the tileassembly 100 may be generally square in shape. As another example, thetile assembly 100 may be generally a circle, triangle, rectangle,parallelogram, pentagon, hexagon, heptagon, octagon, an irregular shape,having one or more curves sides, and the like.

Based on the shape of the tile assembly 100, the tile 102 or stabilizer104 may have a shape similar to the shape of the tile assembly 100. Forexample, where the tile assembly 100 has a generally square shape, thetile 102 or stabilizer 104 may also have a generally square shape. Wherethe tile 102 is not generally a square shape, the tile 102 may be joinedto a stabilizer 104 having a generally square shape such that the tileassembly 100 has a generally square shape.

The tile 102 may be made of a variety of materials. For example, thetile 102 may be resilient flooring that may be made of marmoleum (sheetgoods or modules), vinyl (sheet goods or modules), luxury vinyl tile(LVT; some LVT may have a textured surface and other LVT may have asmooth surface), or vinyl composite tile (VCT). As another example, thetile 102 may be made with narrow or wide width tufted carpet, painted orwoven carpet, or carpet tile. The carpet materials may be glued down,double stitched, or pod and smooth out as appropriate. In someembodiments, the tile 102 may be Laminam® tiles. As another example, thetile 102 may be a laminate tile, porcelain tile, ceramic tile, stonetile, marble tile, and the like.

The tile 102 of the tile assembly 100 may be previously cut, or thematerial for the tile 102 may be purchased to independently fabricatethe tile 102 and independently cut the tile 102. The material of thetile (e.g. marble, porcelain, or ceramic in thin sheets) may be cut intothin sheets (veneer concept) and may be joined with the stabilizer 104.

An example size of the tile 102 may range from ⅜″×⅜″ to 24″×48″, and maybe larger or smaller. An example thickness of the tile 102 may rangefrom ⅛″ to ½″, and may be thicker or thinner. For example, the thicknessof the tile 102 may be 2 mm-4 mm. The size and thickness of the tile 102may affect the amount of stress required to break the tile 102. The sizeand thickness of the tile 102 may be based on the manufacturing processused to make the tile assembly 100. For example, where injectionmoulding is used to manufacture the tile assembly 100 (e.g. join thetile 102 and the stabilizer 104), the size and thickness of the tile 102may be such that the tile 102 does not break during the injectionmoulding process.

The tile assembly 100 may be used in commercial or residential markets.The type of materials used in the tile assembly 100 may be based on theparticular market in which it is used.

In addition to being installed on the floor, the tile assembly 100 maybe mounted to a wall using a mount assembly, which may comprise platesand discs, as described in greater detail herein. The tile assembly 100may be designed to have a reduced weight if the tile assembly 100 is tobe mounted on a surface off the floor, such as a wall.

In some embodiments, the surface of the tile 102 that may be visuallyseen or touched may have designs. For example, the surface of the tile102 may have a colour, a design, a print, a glazing, be smooth, or betextured.

The stabilizer 104 may be joined to the back of the tile 102, such as byco-injection or a second process injection. The stabilizer 104 may havea bubble feature. This bubble feature may provide a water course ormoisture course, assist with self-leveling of the tile assembly 100, mayassist in ease of connecting a tile assembly 100 to another tileassembly 100, and may improve sound-proofing capabilities of the tileassembly 100. The stabilizer 104 or the bubble feature of the stabilizer104 may be made from flexible or compressible polymer.

The stabilizer 104 may be molded, extruded, formed, and/or attached tothe tile 102.

The stabilizer 104 may be manufactured using a variety of materials. Thematerial of the stabilizer 104 may easily create a strong bond orindestructible bond, may not crack (e.g. a high dependability productpolymer or crystalline product), and may be formed into shapes havingdetailed designs and dimensions (e.g. able to form a small recess at asurface of the tile to the top of the surface of the grout). Thestabilizer 104 may be made of foam, or may be made of a polymer, such aspolyethylene terephthalate (PET), or fibre glass, or may be a metallicmaterial, such as steel. Where the stabilizer 104 is made of a polymer,the polymer may be flexible and compressible. The stabilizer 104 maycomprise an adhesive, such as glue, epoxy, polyester, polyurethane,silicone, cement, or the like, to secure the tile assembly 100 to asurface, such as a wall. In some embodiments, the stabilizer 104 maycomprise loops for connecting with hooks of the mount assembly to securethe tile assembly 100 to a surface, such as a wall. In some embodiments,the stabilizer may be steel, aluminum, or a combination thereof.

The stabilizer 104 may be manufactured using moulding, 3D-printing, andthe like.

Initial launches of the tile assembly 100 may be based on entire marketsor partial markets when some F&Bs and life cycle costs advantages aremore important to end user customers.

The tile assembly 100 may replace a portion of carpet tile market withthe ability to deliver high performance atmospheric stability with newnarrow and wide width carpet products. The stabilizer 104 may compriseloops for connecting with hooks to secure the tile assembly 100 to asurface having the hooks. It may be possible to add various anddifferent features based on the materials used for the tile assembly 100and the surface on which the tile assembly 100 is installed. It may bepossible to add various features for specifically addressing certainspecific products in all categories of products.

The tile assembly 100 may replace conventional tiles with “free float”narrow or wide width goods with strategic design for printed or tuftedmaterials. The materials may be physically cut to order.

It some embodiments, it may be possible to replace a portion of carpettile market with the ability to deliver high performance atmosphericstability with new narrow and wide width carpet products. It someembodiments, an improvement may be made to improve backing material forencapsulation and loop lamination and may initially use generation #2improved plates and discs.

It some embodiments, it may be possible to use a new generation #2 plateand disc with improvements (e.g. reduce weight add filler) and obtainClass #1 and European equivalent to Class #1. Where the tile 102 iscarpet, a new generation #2 plate and disc may be used, withimprovements i.e. reduce weight by design and obtain Class #2.

As depicted in FIG. 1 , the edge of the stabilizer 104 may be generallyflush with the edge of the tile 102. In some embodiments, the stabilizer104 may extend past the edge of the tile 102, as depicted in FIG. 2 .

In some embodiments, the stabilizer 104 may be a loop backing made ofstandard loop material. In some embodiments, an adhesive, such as arubber adhesive, may join the stabilizer 104 to the tile 102. In someembodiments, the stabilizer 104 may be attached by hand.

In some embodiments, the tile assembly 100 may comprise an attachmentfeature 106 that may be complementary to an attachment feature 106 ofanother tile assembly 100 for connecting the tile assembly 100 to theanother tile assembly 100 to define a tile system. The connectionbetween the tile assemblies 100 may be a mechanical connection. Theattachment feature 106 of the tile assembly and the attachment feature106 of the another tile assembly 100 may together form a connector forconnecting the tile assembly 100 to the another tile assembly 100.

The attachment feature 106 may allow for mechanical stability when atile assembly 100 is connected to another tile assembly 100. Theattachment feature 106 may bear a similar visual appearance to the groutof conventional tile installations. The attachment feature 106 mayprovide a degree of ingress protection to water.

The attachment feature 106 of the tile assembly 100 may be dimensionedand designed such that the attachment feature 106 does not extend abovethe top surface of the tile assembly 100 (which may be defined by thetop surface of the tile 102) or does not extend below the bottom surfaceof the tile assembly 100 (which may be defined by the bottom surface ofthe tile 102 or the stabilizer 104.

The attachment feature 106 may be water resistant. When the attachmentfeature 106 of a tile assembly 100 is connected to the attachmentfeature 106 of another tile assembly 100, the connector may be awatertight seal. In some embodiments, a rubber seal may be applied tothe attachment feature 106 or the connector to form a watertight seal orimprove water resistance of the attachment feature 106 or the connector.The material used for the attachment feature 106 may keep its shape suchthat the pressure generated between two tile assemblies 100 uponconnection to each other may be maintained.

In some embodiments, the attachment feature 106 may be integrally formedwith the stabilizer 104, as depicted in FIG. 2 or FIG. 3 . In someembodiments, the attachment feature 106 may be separate from thestabilizer 104.

The attachment feature 106 may be manufactured using, for example, 3Dprinting or injection moulding, or another generative manufacturingmethod. In some embodiments, the attachment feature 106 may be injectedmoulded and then a routing process may be used to form the actualengagement/attachment feature.

The attachment feature 106 may be glued to the tile 102, may be mouldedonto the tile 102, or bonded to the tile 102, such as to the edge of thetile 102. In some embodiments, the attachment feature may be made of amagnetic material. In some embodiments, the attachment feature 106 mayinclude one or more magnets or magnetic elements which ensure aconnection and/or supplement the resistive forces provided by amechanical interconnection of two tiles 102.

The attachment feature 106 may be manufactured using a variety ofmaterials that may be similar to the stabilizer 104. The material of theattachment feature 106 may easily create a strong bond or indestructiblebond, may not crack (e.g. a high probability product polymer orcrystalline product), and may be formed into shapes having detaileddesigns and dimensions (e.g. able to form a small recess at a surface ofthe tile to the top of the surface of the grout). The attachment feature106 may be made of foam, or may be made of a polymer, such aspolyethylene terephthalate (PET), magnetic material, or fibre glass, ormay be a metallic material, such as steel. Where the attachment feature106 is made of a polymer, the polymer may be flexible and compressible.The attachment feature 106 may comprise an adhesive to secure to thetile assembly 100.

In some embodiments, loops may be joined to the stabilizer 104 formounting the tile assembly 100 to corresponding hooks on a surface, suchas a mount assembly. In some embodiments, the loops may be adhered tothe stabilizer 104, which may be made of foam. The stabilizer 104 may beconnected to the tile 102 using an adhesive, and may be connected to thetile 102 by hand.

When designing the attachment feature 106 (e.g. its shape, dimensions,designs, appearance) or joining the attachment feature 106 to the tile102, the tolerances of the tile 102 (e.g. length, width, angle definedbetween the length and width) may need to be considered. The cooling orshrinkage of the attachment feature 106 may need to be considered whendesigning the attachment feature 106 or joining the attachment featureto the tile 102.

The attachment feature 106 may have a variety of designs, such as shape,dimensions, designs, or appearance. The attachment feature 106 may becoloured. The attachment feature 106 may be treated to look like grout.The attachment feature 106 may have a recess for joining to the tile 102or for joining with another attachment feature 106. In some embodiments,the attachment feature 106 may comprise a corner or lip. The corner orlip may not be seen, and may help to adjust the shape of the tileassembly 100 and may be a new tolerance for the tile 102.

The attachment features 106 of tile assemblies 100 may be complementaryto one other for connecting the tile assemblies 100. For example, asdepicted in FIG. 3 , the attachment feature 106 may be a male attachmentfeature 108 or a female attachment feature 110. As another example, theattachment feature 106 may have a click-lock feature to lock withanother attachment feature 106. The locking of the attachment features106 may be indicated by a “click” sound. When the attachment features106 are connected together, the seam defined between the attachmentfeatures 106 may be camouflaged. As depicted in FIG. 3 , the tile 102may be set into the stabilizer using, for example, adhesive. The settingof the tile 102 into the stabilizer 104 or grout feature may provideadditional stability, such that the attachments between tilingassemblies 100 may stay relatively level even when on uneven surfaces orin the presence of a height difference between tiling assemblies 100.

The design of the attachment feature 106 may be such that large forcesmay not be required for connecting the tile assemblies 100 and toassemble the tile system, or no big holding forces may be necessary.Further, the attachment feature 106 may have a robust design so that thetile assembly 100 may be used in rough conditions, such as constructionareas. The attachment feature 106 may be designed such that connectedtile assemblies 100 may be disconnected or disassembled without damagingthe tile assemblies 100 so the tile assemblies 100 may be reused againor several times.

In some embodiments, the length of the attachment feature 106 extendingfrom the edge of the tile 102 may be no greater than ⅜″, or no greaterthan 3/16″, thereby providing for an artificial grout. In someembodiments, the length of the attachment feature 106 extending from theedge of the tile 102 may be 3/16″. The length of the attachment feature106 extending from the edge of the tile 102 may be based on the locationthat the tile assembly 100 may be used. For example, the length of thetile attachment feature 106 may be such that typical wheels (e.g. of amachine, a bicycle, stroller, etc.) may roll over the attachment feature106 or high heels of a stiletto may step on the attachment feature 106,and the stress experienced by the attachment feature 106 may be suchthat the attachment feature 106 does not break or become damaged orcause the connected tile assemblies 100 to break or become damaged.

In some embodiments, the attachment feature 106 may be on all sides ofthe tile assembly 100. In some embodiments, opposite or adjacent sidesof the tile assembly 100 may have the attachment feature 106. In someembodiments, the attachment feature 106 may have a click-lock feature.In some embodiments, the attachment feature 106 may have a tongue andgroove feature.

In some embodiments, the tile 102 and the attachment feature 106 may beinjection moulded together in one process. In some embodiments, theattachment feature 106 may be joined to the tile 102 on the bottomsurface of the tile 102 and the edge of the tile 102. In someembodiments, the attachment feature 106 may be joined to the edge of thetile 102.

During the manufacturing process (e.g. injection moulding) of the tileassembly 100, the components of the tile assembly 100 (e.g. tile 102,stabilizer 104, attachment feature 106, etc.) should be able towithstand the stresses of the manufacturing process without damage,breaking, or failure. The tile assembly 100 should be able to withstandhigh impact and rolling loads when installed on the surface, such as thefloor or wall.

In some embodiments, the attachment feature 106 may be injection mouldedto the tile 102 against the bottom surface of the tile 102 and the edgeof the tile with or without the stabilizer 104. For example, the tile102 may be 2 mm, 4 mm, or 8 mm thick.

During manufacturing of the stabilizer 104 or the attachment features106, shrinkage or cooling factors may need to be considered, such thatthere may not be unwanted concave or convex issues.

In some embodiments, the attachment feature 106 may be joined to thetile 102 with one injection moulding process, or may use a secondaryprocess to provide a realistic visual effect of grout. When theattachment features 106 of tile assemblies 100 are joined together, theattachment features 106 may define a line on the top surfaces of theattachment features 106. In some embodiments, the line may meet at oneof the far edges where the tile assemblies 100 come together therebyhiding the potential for visual noticing of the grout line.

The top surface of the attachment feature 106 may have a micro featureto help create the look of conventional grout. The top surface of theattachment feature 106 may be recessed from the top surface of the tile102. The attachment feature 106 (e.g. click-lock, tongue and groove) maylock tile assemblies 100 together sufficiently to perform under highstress and demanding conditions. The attachment feature 106 may bedesigned to allow tile assemblies 100 to be separated from each otherwithout damaging the attachment feature in instances where the tileassembly 100 may be disengaged for replacement, repair, or cleaning. Thematerial (e.g. polymer) used to create the stabilizer 104 or attachmentfeature 106 may be able to maintain integrity when they engage withother attachment features 106 and put under high stresses or rollingstresses.

If there is a void or dip in the floor beneath the tile assembly 100 ortile subsystem (or the floor beneath the tile assembly 100 or tilesubsystem is generally uneven), the stress experienced by the tileassembly 100 from a particular force may be greater compared to when thefloor beneath the tile assembly 100 is relatively even. The materialused for the stabilizer 104 or attachment feature 106 may be such thatthe material maintains its integrity and not crack or be damaged if thefloor beneath the tile assembly 100 or tile subsystem is uneven.

In some embodiments, the attachment feature 106 may frame the tile 102.For example, where the tile 102 is a square, the attachment feature 106may have four sides similar to the tile 102, and opposite or adjacentsides of the attachment feature 106 may have the connections forconnecting with another tile assembly 100.

As depicted in FIG. 2 , the attachment feature 106 may be a generallyflat surface. To join with another tile assembly 100, the attachmentfeature 106 may have an adhesive, a hook or loop, or another featurethat may cooperate with the attachment feature 106 of the other tileassembly 100 to join the tile assemblies 100 together.

As depicted in FIG. 3 , the attachment features 106 of tile assemblies100 may be complementary to one other for connecting the tile assemblies100. For example, the attachment feature 106 may be a male attachmentfeature 108 or a female attachment feature 110. As depicted in FIG. 3 ,on one end of the tile assembly 100 is the male attachment feature 108,and on the opposite end of the tile assembly 100 is the femaleattachment feature 110. In some embodiments, the male attachment feature108 and female attachment feature 110 may be on adjacent sides of thetile assembly 100. The male attachment feature 108 of one tile assembly100 may be received in the female attachment feature 110 of another tileassembly 100 to join the tile assemblies 100 together.

FIG. 4 is a schematic of a cross-sectional view of a tile system 400 aand a tile system 400 b. Tile system 400 a comprises two tile assemblies100 having tiles 102 and stabilizers 104 joined together with attachmentfeatures 106. Tile system 400 b is generally similar to tile system 400a, except that the tiles 102 of tile system 400 a have no tapered edge,and the tiles 102 of the tile system 400 b have tapered edges 408.Accordingly, the attachment features 106 may be designed such that itmay adhere to the tapered edge 408. In some embodiments, attachmentfeatures 106 include magnetic elements which enhance the strength ofconnections between tile systems 400 a, 400 b. In any of the embodimentsdescribed herein, various attachments 106 and male 108 and female 110connectors may be made entirely of magnetic materials, or includemagnetic elements for enhancing the force of attraction betweenconnected tile systems.

The attachment features 106 of the tile assembly 100 may bepre-fabricated and may be used with free-float installations ofstabilized tiles 102. The attachment features 106 may be pre-attached ina factory or on site, or not attached to the tile 102 at all.

In some embodiments, the attachment features 106 of the tile assembly100 may be a single piece separate from the tile assemblies 100 thatjoins tile assemblies 100 together. The attachment feature 106 may bedesigned and configured to contact the tile assemblies 100 and connectwith the tile assemblies 100.

In some embodiments, the attachment feature 106 may be pre-fabricated.In some embodiments, the attachment feature 106 may be liquid or partlyliquid and may be applied on site.

The stabilizer 104 may comprise a feature for mounting to a surface(e.g. hook or loop, or adhesive). The stabilizer 104 may be connected toa surface having the other of the hook or loop, or may be joined to asurface by the adhesive. In some embodiments, the adhesive may be on thesurface, and the tile assembly 100 may be joined to the surface.

In some embodiments, the tile assembly 100 may not have a stabilizer104. In some embodiments, stabilizer 104 may be present if required(e.g. if the surface on which the tile assembly 100 is installed isuneven).

In some embodiments, the stabilizer 104 may be embedded in the tile 102(e.g. in the center of the tile 102). In some embodiments, thestabilizer 104 may be installed between two tiles 102.

In some embodiments, where the exist floor substrate is reasonably flat,it may be possible to use pre-fabricated attachment features 106, eitherpre-attached to the tile 102 or attached on site during installation, onat a least two sides of tile 102 to enable the tile assembly 100 to beinstalled without any attachment to the floor or existing substrate. Insuch embodiments, a resilient, sound proof, leveling layer could be usedeither separately or attached (e.g. as shown in FIG. 118 ).

FIG. 118 is an example embodiment of a tile assembly 11800. As depicted,tile assembly 11800 includes a first tile 11802 a, a second tile 11802 bseparated by a stabilizing layer 11804, and an optional soundproofinglayer 11850, all encased by attachment feature 11806. In someembodiments, first tile 11802 a may have a decorative covering. In someembodiments, stabilizer 11804 may be a fiberglass layer, with adhesiveon one or both sides for bonding to the tiles. In some embodiments, thesoundproofing layer 11850 is made of cork or another material suitablefor soundproofing. In some embodiments, the attachment feature 11806 hasadhesive on an inner surface to bond with the other elements 11802 a,11802 b, 11804, 11850. In some embodiments, the first tile 11802 a,stabilizing layer 11804 and second tile 11802 b may have a thickness,when stacked, of approximately 50-75 mm. More particularly, the stackedthickness may be approximately 0.5-1.0 inches. More particularly, thethickness may be approximately 5-7 mm. In some embodiments, thestabilizing layer 11804 may be a compressible polymer, foam,polyethylene terephthalate (PET), or a metallic material such as steelor aluminum.

In some embodiments, the attachment feature 106 may be pre-applied onsite and adhesively attached on site, could be pre-applied offsite oronsite, could be pre-fabricated on the tile 102, or could be joined withthe tile 102 with pressure and without use of adhesive.

FIG. 5 is another schematic of a cross-sectional view of a tile system500. The tiles of the tile system 500 have tapered edges.

FIG. 6 is a schematic of example edges of a tile 102 of a tile assembly100. Different types of edges are possible. For example, as illustratedin FIG. 6 , tile 602 a has a recess in its edge, tile 602 b has a curvededge, tile 602 c has a smaller recess in its edge, and tile 602 d has aV-shape edge.

FIG. 7 is a schematic of the attachment feature of the tile 102. Forexample, attachment feature 706 a may be pre-fabricated and may bepre-attached to the tile 102. For example, attachment feature 706 b maybe pre-fabricated and may or may not have an adhesive layer for joiningwith the tile 102. For example, attachment feature 706 c may have anadhesive layer on both sides to join with the tile 102 and with theattachment feature of another tile assembly 100.

FIG. 8 is a schematic of the attachment feature of the tile 102. In someembodiments, attachment feature 806 a may be pre-fabricated and on allsides of the tile 102, either pre-attached or attached on site. Asdepicted, tile 102 is square, so each of the four sides of the tile hasthe attachment feature 806 a. In some embodiments, attachment features806 b of tile assemblies 100 may define a seam 808 therebetween. Theseam 808 may or may not have an adhesive for connecting the tileassemblies 100 together. In some embodiments, attachment feature 806 cmay be pre-fabricated and may have a hook and loop or adhesive toimprove ease of installation and reduce possibility of capillary actionupward. In some embodiments, attachment feature 806 d may extend pastthe edge of the tile 102 to produce additional “pressure” for tightlyjoining the tile assemblies 100 or camouflaging the seam defined by theattachment features 106 of the tile assemblies 100.

The attachment feature 106 may be made of rigid or flexible material. Insome embodiments, the attachment feature 106 may have some flexibilityand/or resilience to allow for pressuring when one tile assembly 100 isinstalled side by side to another tile assembly 100. Flexibility and/orresilience of the attachment feature 106 may also provide for somemovement between tile assemblies 100 to absorb when installed.

In some embodiments, a slip sheet may be used to provide for the abilityto pressure a tile 102 against a flexible pre-fabricated or mouldedattachment feature 106. This may work with attachment features 106 ofvarious shapes or designs.

Moulds of stabilizer 104 may be used for one or two step manufacturingof the tile assembly 100, and may be with or without attachment feature106 on the mould.

In some embodiments, the surface of the attachment features 106 that maybe visually seen or touched may have designs. For example, the surfaceof the attachment features 106 may have a colour, a design, a print, aglazing, be smooth, or be textured.

In some embodiments, the tile assembly 100 may be waterproof or may beapplied with a material so it may be water proof. In some embodiments,the tile assembly 100 may be installed on a wall, for example in ashower stall, to protect the wall from liquids.

FIG. 9 is a schematic of an attachment feature 106 of the tile assembly100. The tile assembly 100 may have a tile 102, a stabilizer 104 (whichmay be made of a polymer such as PET), and an attachment feature 106.Two tile assemblies 100 may be connected together using attachmentfeatures 106 to be a tile system 900. As depicted in FIG. 9 , theattachment feature 106 may be a male attachment feature 108 or a femaleattachment feature 110. Some sides of the tile assembly 100 may have themale attachment feature 108, and other sides of the tile assembly 100may have the female attachment feature 110. For example, as depicted inFIG. 9 , where the tile assembly 100 has four sides such as a squareshape, the male attachment features 108 may be on adjacent sides and thefemale attachment features 110 may be on adjacent sides, or the sidehaving the male attachment feature 108 opposes the side having thefemale attachment feature 110. Two tile assemblies 100 may be connectedtogether, using a male attachment feature 108 and a female attachmentfeature 110, to form a tile assembly 900.

FIG. 10 is a schematic of an example male attachment feature 108 and anexample female attachment feature 110. As depicted in FIG. 10 , the maleattachment feature 108 may have a protrusion with adjacent sides thatare perpendicular. The male attachment feature 108 may have a generallyrectangular protrusion. Similarly, the female attachment feature 110 mayhave a recess with adjacent sides that are perpendicular. The femaleattachment feature 110 may have a generally rectangular recess. In someembodiments, as depicted in FIG. 10 , the attachment features 106 (e.g.male or female attachment feature 106 or 108) of the tile assembly 100may extend along the entire side of the tile assembly 100. In someembodiments, the attachment features 106 (e.g. male or female attachmentfeature 106 or 108) may be only at certain positions of the side of thetile assembly 100. For example, the female attachment feature 110 mayextend along an entire side of the tile assembly 100. As anotherexample, the male attachment feature 108 may only be at one or morediscrete positions of the side of the tile assembly 100.

FIG. 11 is a schematic of an example male attachment feature 108 and anexample female attachment feature 110 connected together.

FIG. 12 is a schematic of other example attachment features of the tileassembly 100. The tile assemblies 1200 a and 1200 b have click-lockattachment features 106. As depicted in FIG. 12 , a curved portion of anattachment feature 106 may be received in a curved portion of anotherattachment feature 106. The tile assembly 1200 a or the tile assembly1200 b may have to be angled relative to the other to slide the tileassemblies 1200 a and 1200 b together for the attachment features 106 toconnect. When the attachment features 106 connect, the tile assembly1200 a or the tile assembly 1200 b may be lowered relative to the other.Upon lowering of the tile assembly 1200 a or the tile assembly 1200 brelative to the other, the click-lock attachment features 106 mayengage. Their engagement may be indicated by a “click sound”. Asdepicted in FIG. 12 , the attachment features 106 of the tile assembly1200 a and 1200 b may be joined at the edge of the tiles 102 of the tileassembly 1200 a and 1200 b.

As depicted in FIG. 12A, the tile assemblies 1200 c and 1200 d havetongue and groove male and female attachment features 108 and 110. Themale attachment feature 108 on tile assembly 1200 d has a generallyground protrusion. Similarly, the female attachment feature 110 on tileassembly 1200 c has a generally ground recess. The opening of the recessof the female attachment feature 110 may be smaller than the largestpart of the male attachment feature 108. In some embodiments, the maleattachment feature 108 may elastically deform when the male attachmentfeature 108 is being received in the female attachment feature 110. Whenthe male attachment feature 108 is received in the female attachmentfeature 110, the male attachment feature 108 may return to its originalshape. This may increase the tightness of the connection between themale and female attachment features 108 and 110, and may requireadditional force to separate the tile assemblies 1200 c and 1200 d. Asdepicted in FIG. 12 , the attachment feature 110 of the tile assembly1200 c may be joined at the edge of the tile 102 and at the bottom ofthe tile 102 of the tile assembly 1200 c. the attachment feature 108 ofthe tile assembly 1200 d may be joined at the edge of the tile 102 ofthe tile assembly 1200 d.

As depicted in FIG. 12A, the attachment feature 106 of tile assembly1200 a and the attachment feature 110 of tile assembly 1200 c may havean edge that extends from the tile assembly 1200 a and tile assembly1200 c to tile assembly 1200 b and tile assembly 1200 d, respectively.In some embodiments, the edge of the attachment features 106 and 110 mayabut the edge of the tile 102 of the tile assembly 1200 b and tileassembly 1200 d to hide or camouflage the attachment feature line orseam, which may provide a clean and aesthetically pleasing finish whenthe tile assemblies 1200 a, 1200 b, 1200 c, or 1200 d are installed on asurface.

As depicted in FIG. 12A, there may be a routed recess 112 in the edge ofthe tiles 102 of the tile assemblies 1200 a and 1200 c. The recess 112may be along one or more edges of the tiles of the tile assemblies 1200a and 1200 c. The recess 112 may be along all edges of the tiles of thetile assemblies 1200 a and 1200 c. In some embodiments, the attachmentfeature attached to the edge of the tile 102 having the recess 112 mayhave a corresponding protrusion to be received in the recess 112 toconnect the attachment feature to the tile 102. As depicted in FIG. 12A,the attachment feature 106 of tile assembly 1200 a and the attachmentfeature 110 of the attachment feature 1200 c has such a protrusionreceived in the recess 112 of the tiles 102 of the tile assembly 1200 aand the tile assembly 1200 c.

In some embodiments, when the tile and the attachment feature of a tileassembly are joined together, there may be a recess 114 defined betweenthe top surface of the tile and the top surface of the attachmentfeature. For example, as depicted in FIG. 12 in tile assembly 1200 a andtile assembly 1200 c, the top surfaces of the tiles 102 and the topsurfaces of the attachment features 106 and 110 define a recess 114.This may provide an appearance of conventional grout when the tileassemblies are installed on a surface. In some embodiments, the recessmay be camouflaged (e.g. by scoring) to achieve an appearance similar tothat of conventional grout.

FIG. 12B is a schematic of an alternative embodiment of a tongue andgroove attachment feature of a tile assembly, in accordance with someembodiments. In the example embodiment of FIG. 12B, the tongue andgroove attachment feature includes magnetic elements. As depicted, thetongue is a continuous tongue which is interspersed with magnets 1280and polymers 1281 along the length of the tongue to form a solid tongue.Likewise, the groove attachment includes complementary magnets 1282,which facilitate the creation of a solid and strong connection betweenthe tile assemblies 1200 e, 1200 f. In some embodiments, the connectionbetween tile assemblies 1200 e, 1200 f may be sufficiently strong toprevent vertical lift between tile assemblies 1200 e, 1200 f insituations where the substrate beneath the tiling system is uneven. Insome embodiments, the magnetic elements may be 1 mm thick, 2-3 mm wide,and 10-20 mm long and incrementally placed approximately every 3-4inches. The foregoing dimensions represent merely an example embodiment,and that configurations with other dimensions are possible andcontemplated herein. In particular, configurations may be chosen to meetwhatever is required for a particular situation or layout.

FIG. 13 is a schematic of another tongue and groove attachment featureof the tile assembly. The tile assembly 1300 a has a female attachmentfeature 110, and the tile assembly 1300 b has a male attachment feature108. The male attachment feature 108 has a generally round protrusion,and the female attachment feature 110 has a generally round recess. Theattachment features 108 and 110 may be designed so as to provideattachment sufficient to prevent disengagement during normal use, yet itmay be possible to disengage the tile assemblies 1300 a and 1300 b byangular pressure without damaging the attachment features 108 and 110.

As depicted in FIG. 13 , as an example, the maximum length of theconnector defined by the attachment features 108 to 110 may be 3/16″-⅜″.

FIG. 14 and FIG. 5 are schematics of another attachment feature of thetile assembly. As depicted in FIG. 14 , the tile assembly 1400 a and thetile assembly 1400 b has attachment features 106 that are complementaryto each other. The attachment features 106 may have a click-lockfeature. In some embodiments, as depicted in FIG. 14 , the attachmentfeature 106 of the tile assembly 1400 a may comprise a flange or lip 116so as to maintain pressure and create a water seal or increase waterresistance of the connection between the attachment features 106. Theattachment feature 106 of the tile assembly 1400 b may have a channel118 for receiving the flange or lip 116.

FIG. 16 is a schematic of another attachment feature of the tileassembly. The attachment features 106 of tile assemblies may becomplementary and cooperatively configured to connect tile assembliestogether to form a tile system. In some embodiments, an adhesive 120 maybe used between the attachment features 106 to promote connection of thetile assemblies.

In some embodiments, the attachment features 106 may have flanges 1600.The flange 1600 of one attachment feature 106 may engage with the flange1600 of another attachment feature 106 to promote connection of the tileassemblies. The flanges may be received in recesses 1602 defined in theattachment features 106.

FIG. 17 is a schematic of other example attachment features of the tileassembly. As depicted in FIG. 17 , attachment features 1706 a and 1706 beach have protrusions, and recesses for receiving the protrusions of theother. As depicted, the protrusion of attachment feature 1706 a is belowthe protrusion of attachment feature 1706 b, and the recess ofattachment feature 1706 a is above the recess of attachment feature 1706b.

As depicted in FIG. 17 , attachment features 1706 c and 1706 d may begenerally similar to attachment features 1706 a and 1706 b, except theattachment features 1706 c and 1706 d further comprise a hook and loopor pressure-sensitive adhesive (PSA) for connecting attachment features1706 c and 1706 d together. One of attachment features 1706 c and 1706 dmay have the hook or loop or PSA, and the other one of attachmentfeatures 1706 c and 1706 d may have the corresponding hook or loop orPSA. In some embodiments, the hook and loop or PSA for connectingattachment features may include one or more magnetic elements. In someembodiments, the hook and loop may be made entirely of magneticelements. In some embodiments, magnetic elements may be interspersed inthe hook and loop together with other materials. The magnetic elementsmay be arranged so as to provide complementary magnets to generate anattractive force between the hook and loop.

As depicted in FIG. 17 , attachment features 1706 e and 1706 f may bebeveled, chamfered, or otherwise shaped to promote connecting theattachment features 1706 e and 1706 f together.

FIG. 18 is a schematic of another attachment feature of the tileassembly. The attachment features 106 depicted in FIG. 18 may be made ofpolymer, and may have a “click-lock” feature. As depicted in FIG. 18 ,the attachment features 106 may be integrally formed with the stabilizer104. The stabilizer 104 and the attachment features 106 may be joined tothe tiles 102. In some embodiments, the thickness of the stabilizer 104may be less than 1/32″ or may be greater than 1/32″. In someembodiments, the thickness of the stabilizer 104 may be from ⅛″ to ¼″.In some embodiments, the thickness of the tile 102 may be approximately2 mm. In some embodiments, the thickness of the tile 102 may be greaterthan 2 mm, such as approximately 4 mm. In some embodiments, all bondsbetween the tile 102 and the stabilizer 104 and/or attachment feature106 may be strong, and may keep the tile assemblies connected togetherwhen forces are applied on the tile assemblies.

In some embodiments, it may be desirable to eliminate or reduce thevisible line where the attachment features 106 come together on the topsurface of the connector or grout surface.

FIG. 19 is a schematic of three example attachment features of the tileassembly. The attachment features 106 depicted in FIG. 19 may becooperative male and female attachment features 108 and 110. The maleattachment feature 108 may have a bulbous protrusion, and the femaleattachment feature 110 may have a similarly shaped recess for receivingthe male attachment feature 108. As depicted in FIG. 19 , it may bepossible at the entire attachment features 108 and 110 may be containedwithin the side or edge of the tile 102, such that the attachmentfeatures 108 or 110 do not extend beyond the top or bottom surface ofthe tile 102. In some embodiments, the attachment features 108 and 110may not be injection moulded to the tile 102.

FIG. 20 is a schematic of two tile assemblies 100 a and 100 b connectedtogether with attachment features. FIG. 20 depicts complementaryattachment features 108 and 110. The attachment features 108 and 110 mayhave a click-lock feature. The attachment feature 108 may have a ridgereceived in a corresponding channel of the attachment feature 110. Asdepicted in FIG. 20 , the attachment features 108 and 110 may only be atone part of the edge of the tile 102, rather than extend along theentire edge of the tile 102. In some embodiments, as depicted in FIG. 20, the attachment features 108 and 110 may be connected to the edge ofthe tile 102 and the bottom of the tile 102, and may be separate fromthe stabilizer 104, which may also be connected to the bottom of thetile 102.

FIG. 21 is a schematic of the attachment feature 108 of FIG. 20 .

FIG. 22 is a schematic of the attachment features 108 and 110 connectingtwo tile assemblies 100 a and 100 b together. As depicted, a wheel isrolling over the connector defined by the attachment features 108 and110. In some embodiments, the connection of the attachment features 108and 110 may be able to remain connected and maintain connection of thetile assemblies when a rolling load or rolling stress is applied.

FIG. 23 is a schematic of a tile system 2350 formed from four tileassemblies 100 a-100 d. As depicted, the attachment features 106 mayextend along the entire edges of the tile assemblies.

FIG. 24 is a schematic of two tile assemblies 100 a and 100 b joinedtogether with attachment features 106.

FIG. 25 is a schematic of a tile assembly 100 having an attachmentfeature 106. As depicted in FIG. 25 , the attachment feature 106 maycomprise a rib 2502 to promote connecting with a correspondingattachment feature 106 on another tile assembly.

FIG. 26 is a schematic of a tile assembly 100 having an attachmentfeature 106. As depicted in FIG. 26 , the attachment feature 106 maycomprise a slot 2602 to promote connecting with a correspondingattachment feature 106 on another tile assembly.

FIG. 27 is a schematic of a tile assembly 100.

FIG. 28 is a schematic of a tile assembly 100 having a male attachmentfeature 108 that is connected with a female attachment feature 110. Asdepicted in FIG. 28 , the male attachment feature 108 has a bulbousprotrusion that may be generally round, and may have chamfered orbevelled sides for fitting into a recess of the female attachmentfeature 110 having a generally similar shape.

As depicted in FIG. 28 , in some embodiments, one of the attachmentfeatures may extend along an entire side or a portion of an entire sideof a tile, and the other of the attachment features may be at discretepositions along the side of the tile. For example, the female attachmentfeature 110 depicted in FIG. 28 may be at discrete positions along aside of a tile. There may be one or more such female attachment features110 along a side of the tile. These female attachment features 110 maynot be connected or joined together, and the male attachment feature 110depicted in FIG. 28 may extend along a side or a portion of a side of atile 102. Accordingly, when connecting two tile assemblies together,there may be a male attachment feature 108 for attaching with the one ormore female attachment features 110 even if the tile assemblies are notperfectly aligned with each other during installation, which may promoteconnection of the two tile assemblies and ease of use of the tileassemblies.

FIG. 29 is a schematic of two tile assemblies 100 a and 100 b connectedtogether by male attachment feature 108 and female attachment feature110 to form a tile system 2950.

FIGS. 30-34 depict the tile assemblies 100 a and 100 b of FIG. 29separated from each other. As depicted in FIGS. 30-34 , the maleattachment feature 108 may have a ridge, lip, or tongue, on a protrusionthat may be received in a slot or channel of the female attachmentfeature 110. The protrusion of the male attachment feature 108 may bereceived in a recess of the female attachment feature 110 having asimilar shape as the protrusion. The top surface of the femaleattachment feature 110 way extend from tile assembly 100 a to tileassembly 100 b such that the leading edge of the female attachmentfeature 110 is proximate to the tile assembly 100 b to camouflage orhide this leading edge. As depicted, the top surface of the femaleattachment feature 110 is below the top surfaces of the tiles of tileassembly 100 a and tile assembly 100 b, such that the connector or groutformed between the tile assemblies 100 a and 100 b may have a recessedappearance. As depicted, the tile assemblies 100 a and 100 b havediscrete male and female attachment features 108 and 110 that do notextend along an entire side of the tile. Rather, there may be one ormore than one male and female attachment features 108 and 110 forconnecting the two tile assemblies 100 a and 100 b.

FIG. 35 is a schematic of attaching a tile assembly 100 a to other tileassembles 100 b and 100 c to form a tile system 3500. In someembodiments, as depicted in FIG. 35 , the edge of tile assembly 100 afacing tile assembly 100 b may comprise an attachment feature 106 a thatmay be a tongue or a groove corresponding to the attachment feature ontile assembly 100 b facing tile assembly 100 a, and the edge of tileassembly 100 a facing tile assembly 100 c may comprise an attachmentfeature 106 b that may have a click-lock feature corresponding to theattachment feature on tile assembly 100 c facing tile assembly 100 a.

To connect the tile assembly 100 a to the assemblies 100 b and 100 c, insome embodiments, the tile assembly 100 a may first be connected to tileassembly 100 c by angling the tile assembly 100 a relative to the tileassembly 100 c and connecting the attachment feature 106 b to thecorresponding attachment feature of tile assembly 100 c. After theattachment feature 106 b of tile assembly 100 a connects with thecorresponding attachment feature of tile assembly 100 c, the tileassembly 100 a may be lowered to be generally level with the tileassembly 100 c. Then, the tile assembly 100 a may be moved towards tileassembly 100 b, while maintaining connection with tile assembly 100 c.Then, the attachment feature 106 a may connect the tile assembly 100 ato tile assembly 100 b by connecting with the corresponding attachmentfeature of tile assembly 100 b. In some embodiments, tile assembly 100 amay not be directly connected to tile assembly 100 d, but tile assembly100 d may be connected to tile assemblies 100 b and 100 c. With the tileassemblies connected together, the tile assemblies may form a tilesystem 3500.

FIG. 36 is a schematic of attaching a tile assembly 100 to another tileassembly to form a tile system 3600. FIG. 36 depicts an example sequenceof attachment of down and left to assemble the tile system 3600. A tileassembly 100 may be moved generally downward until it connects withanother tile assembly, and then moved to the left until it connects withanother tile assembly. When the tile assembly 100 is connected to twotile assemblies, the tile assembly 100 is secured as part of the tilesystem 3600. In some embodiments, sequence of attachment may be down andright, left and down, right and down, up and left, up and right, leftand up, and right and up. The configuration and positioning of theattachment features of the tile assemblies of the tile system maycorrespond to the sequence of attachment to assemble the tile system.

As depicted in FIG. 36 , the tile assembly 100 may comprise a maleattachment feature 108 on the top and right edges and a femaleattachment feature on the left and bottom edges. In some embodiments,the male attachment feature 108 may be on opposing edges or the femaleattachment feature 110 may be on opposing edges. In some embodiments,more edges of the tile assembly 100 may have one kind of attachmentfeature, and fewer edges may have another kind of attachment feature.

FIG. 37 is a schematic of attaching a tile assembly to another tileassembly to form a tile system 3700. As depicted in FIG. 37 , the tilesystem 3700 has 9 tile assemblies 100. In some embodiments, the tileassembly of the tile system 3700 may be tile assembly 100 a. Tileassembly 100 a may have attachment features 106 a and 106 c that mayhave a click-lock feature, and may have attachment features 106 b and106 d that may have a tongue and groove feature. In some embodiments,the tile assembly of the tile system 3700 may be tile assembly 100 b.Tile assembly 100 b may have attachment features 106 e and 106 f thatmay be male attachment features, and may have attachment features 106 gand 106 f that may be female attachment features. The configuration,design, and positioning on the sides of the tile assembly 100 of theattachment features 106 may be changed as appropriate to suit theinstallation method.

FIG. 38 is a schematic of a tile system 3800. As depicted in FIG. 38 ,additional tile assemblies may be connected to the tile system 3800,such that the tile system 3800 may extend longitudinally, laterally, ora combination thereof.

FIG. 39 is a schematic of a tile system 3900. The tile system 3900, asdepicted, comprises 4 tile assemblies. In some embodiments, such asdepicted in tile system 3900 a, the tile assemblies of the tile system3900 a may be generally the same size and shape. In some embodiments,such as depicted in tile system 3900 b, some of the tile assemblies ofthe tile system 3900 b may have a size and shape different from others.For example, the tile system 3900 b has some tile assemblies that aregenerally square in shape and other tile assemblies that are generallyrectangular in shape.

In some embodiments, the bottom surface of the tile 102 may be acoupling surface for releasably mounting the tile assembly 100 toanother coupling surface that is complementary to coupling surface ofthe tile 102. The coupling surface of the tile 102 may be hooks orloops, and the another coupling surface may be the other of hooks orloops.

In some embodiments, the tile assembly 100 may be designed withtolerances for installation. For example, there may be gaps in lockinglaps to determine forgiveness, such as when sliding vertically orhorizontally. In some embodiments, the gaps may be 1/32^(nd)-⅛^(th) ofan inch. More particularly, the gaps may be 1/16^(th)-¼^(th) of an inch.More particularly, the gaps may be 3/16^(th) of an inch.

In some embodiments, the tile assembly 100 may be cut on site. The tileassembly 100 may be scored or cut, for example, with a wet saw.

The tile assemblies described above in FIGS. 1-39 comprise a tile joinedto a stabilizer and a connector. In some embodiments, the tileassemblies may comprise more than one tile.

FIG. 40 is a schematic of a tile assembly 4000 that may be generallysimilar to the tile assemblies described herein in FIGS. 1-39 (e.g. tileassembly 100), except tile assembly 4000 has two tiles 4002 a and 4002 bstacked on top of one another with a stabilizer 4004 between the twotiles 4002 a and 4002 b. As depicted in FIG. 40 , tile assembly 4000comprises attachment features 4006 that mechanically connects tileassemblies 4000 together.

Although FIG. 40 depicts attachment features 4006 at the sides of tiles4002 a, 4002 b, it should be appreciated that other configurations arepossible. For example, the attachment feature 4006 may extend through topart of the underside of the tile assembly in addition to some or all ofthe sides of the tile assembly. The attachment feature 4006 may alsoextend through the entire underside of the tile assembly. The attachmentfeature 4006 may also extend through the entire underside of the tileassembly and also up some or all of the sides of the tile assembly.

In some embodiments, the attachment feature 4006 may be made ofmaterials which are malleable, including polyurethane, rubber, silicone,ionomer, thermoplastic elastomer, polyvinyl chloride (PVC), low-densitypolyethylene (LDPE), or the like. The malleable nature of the attachmentfeature 4006 may allow for individual tile assemblies connected to oneanother to form an entire floor system, as the malleable nature of thetiles would enable the tile assemblies to conform to the contours of theunderlying floor, as well as allow for some tolerance of expansion andcontraction (e.g. for different temperatures, humidity levels, or thelike). In embodiments where the tile assembly is used as a wallcovering, the malleable nature of the attachment feature 4006 may allowthe tiling system to leverage the natural gravitational force acting ontiles to use the weight of the tiles to engage the connections betweentiles to a point where the connections between tile assemblies aresubstantially waterproof.

In some embodiments, the attachment feature 4006 may be laminated to theside of the tile assembly. In some embodiments, the attachment featuremay be laminated to more than one side of the tile assembly, and in someembodiments may be laminated to each side of the tile assembly (e.g. asshown in FIG. 118 ). In some embodiments, the tile assembly may be cutto precisely fit together with the attachment feature 4006. In someembodiments, cutting is carried out using water jet cutting. In someembodiments, 3D printing may be used to ensure a precise fit betweentile assembly and attachment feature. In some embodiments, theattachment feature 4006 is first attached to the side of the tileassembly and is then milled to form the appropriate geometry forconnection to other attachment features. In some embodiments, theattachment feature is formed using injection molding.

In some embodiments, the tile assembly 4000 may be two tiles (e.g.laminated tiles) of exterior cladding with a stabilizer 4004 made offibre glass in the centre. The fibre glass may be a fibre glass cloth.

In some embodiments, the tiles 4002 a, 4002 b may be made of porcelain,and in particular of double-glazed porcelain. Tile 4002 a may beproduced using a double glazing porcelain production process.Conventional double layer porcelain manufacturing has typically notallowed for much flexibility in terms of finishes, chiefly becauseconventional manufacturing methods do not allow for printing optionscapable of producing a wide range of colours and/or patterns. Inconventional double layer manufacturing, the patterning/colouration isdone during an initial manufacturing process, and not as a secondarystep. As such, many manufacturers are opting not to use double layermanufacturing because it is a relatively expensive process, whichtypically necessitates large batches in order to render the processcost-effective, and does not provide much flexibility or capability fordifferent visual surface finishes. However, in some embodiments, it ispossible to use ink-jet printing technologies to print on the othersurface of double-layered products.

In some embodiments, the modified double layer porcelain manufacturingprocess may allow for the possibility of the insertion of a fiberglass(or other stabilizing layer) layer between two layers of porcelain. Insome embodiments, once the fiberglass layer is inserted onto the firstlayer of porcelain powder/paste, pressure may be applied so as to allowthe fiberglass to embed well and reduce the possibility of air pockets.

In embodiments in which a second tile 4002 b is placed on the both sidesof the stabilizer 4004 (e.g. fiberglass), pressure may be applied to thefirst layer of porcelain powder/paste and fiberglass prior to the secondlayer of porcelain paste/powder being applied. In some embodiments, themodified double layer porcelain manufacturing process may allow fortiles with a thickness of 9 mm or less. By introducing a layer offiberglass (or other stabilizer) in between layers of porcelain duringthe manufacturing process, this may provide a lower-cost method ofmanufacturing tiles than those presently known.

In some embodiments, the tile 4000 a may be porcelain (veneer) rectifiedand the tile 4000 b may be ceramic tile rectified.

In some embodiments, the tile assembly 4000 may be a composite tile,comprising two ceramic layers (e.g. two tiles) on the outside and oneorthotropic glass fibre layer in the middle.

In some embodiments, the tiles 4000 a and 4000 b may be laminatedtogether with polyurethane and fibre glass.

In some embodiments, the tile assembly 4000 may comprise a backingmaterial, such as foam, loops, or polymer. Where the tile assembly 4000is to be installed on a floor, the backing material may be foam. Wherethe tile assembly 4000 is to be installed on a wall, the backingmaterial may have a material for mounting or connecting the tileassembly 4000 to the wall, such as loops. The backing material may besufficiently suitable to withstand high stress applied to the tileassembly 4000 (e.g. from a focused point like the heel of a stiletto).The backing material may be reinforced with fibre glass.

In some embodiments, the stabilizer 4000 may be a metallic material suchas steel.

In some embodiments, the tile assembly 4000 may be connected to othertile assemblies 4000 to form a tile system. This tile system may beinstalled on a surface, such as a floor or a wall. When the tile systemcomprising tile assemblies 4000 is installed on a floor, the tileassemblies 4000 of the tile system may “free float” on the floor, andthe tile system comprising tile assemblies 4000 may be stabilized on thefloor.

In some embodiments, the tile assembly 4000 may be difficult to break.

The tile assembly 4000 may be used as a subsurface or as a surface.

In some embodiments, the load applied to the tile assembly 4000 may bedistributed to its components, such as to first tile 4002 a, second tile4002 b, stabilizer 4004, attachment feature 4006, or a combinationthereof.

After the tile assemblies 4000 are connected together to form a tilesystem, the tile assemblies 4000 may be separate for replacement,repair, cleaning, and the like.

In some embodiments, the tile assembly 4000 may be manufactured with twotiles, each having at least one generally flat surface, and areinforcing fibre fabric that may be laminated to the two tiles. Thereinforcing fabric may be joined to the tiles using a resin. In someembodiments, the tile 4000 b may be a thin Laminam® tile.

In some embodiments, the stabilizer 4004 (e.g. the fibre glass) betweenthe two tiles 4002 a and 4002 b may disallow the stress required tocrack the tile 4002 a or tile 4002 b due to stiffness of the stabilizer4004. When the stabilizer 4004 is fibre glass, the stabilizer 4004 mayhave a stiffness that is higher than the stiffness of the tiles 4002 aor 4002 b.

Where the stabilizer 4004 is fibre glass, there may be vertical orhorizontal stiffness.

In some embodiments, there may be more than one layer of stabilizer 4004between the two tiles 4002 a or 4002 b.

In some embodiments, where the stabilizer 4004 is fibre glass, the fibreglass may be tightened to reduce the gaps in the wave of the fibreglass. This may avoid stiffness loss of the fibre glass.

The tile 4002 a or the tile 4002 b may have a thickness such that thetiles do not break during harsh conditions, such as conditions with highstress. The thickness of the tile assembly 4000 may be based on its use.For example, where the tile assembly 4000 is to be installed on a flooror near a door, the tile assembly 4000 may not be so thick so as toobstruct movement of doors.

In some embodiments, the tile 4002 a or tile 4002 b may be square.

In some embodiments, the stabilizer 4004 between the tile 4002 a andtile 4002 b may be foam.

In some embodiments, the attachment features 4006 may be between the topand bottom surfaces of the tile assembly 4000. When attachment features4006 of tile assemblies are connected together to connect the tileassemblies 4000, the connector defined by the connected attachmentfeatures 4006 may be water resistant, water tight, or durable.

In some embodiments, the fibre glass stabilizer 4004 may extend past thedimensions of the tile 4002 a or tile 4002 b. In some embodiments, thefibre glass stabilizer 4004 may not extend past the dimensions of thetile 4002 a or tile 4002 b and terminate at the edge of the tile 4002 aor tile 4002 b.

In some embodiments, a Mayor machine may laminate a fibre glassstabilizer 4004 to the tiles 4002 a and 4002 b.

To join the fibre glass to the tiles 4002 a and 4002 b, fibre glass on aroll with uncured adhesive may provide alignment with the tiles 4002 aand 4002 b. A jig may assist with aligning the fibre glass and the tiles4002 a and 4002 b.

In some embodiments, it may be difficult to separate the tiles 4002 a or4002 b from the stabilizer 4004.

The connection between tile assemblies 4000 may be sufficiently strongsuch that rolling loads applied to the tile system does not disconnectthe tile assemblies 4000 or damage the tile assemblies 4000.

In some embodiments, the components of the tile assemblies 4000 (e.g.tile 4000 a, tile 4000 b, stabilizer 4004, attachment feature 4006,etc.) that may be visually seen or touched may have designs. Forexample, the components of the tile assemblies 4000 may have a colour, adesign, a print, a glazing, be smooth, or be textured.

In some embodiments, if using a crystalline product, fibre glass may notbe needed. In some embodiments, if using crystalline product, fibreglass may be needed.

In some embodiments, the tiles 4002 a and/or 4002 b may be generallysimilar to the tiles described herein in FIGS. 1-39 (e.g. tile 102).

As depicted in FIG. 40 , the tiles 4002 a and 4002 b are generallysimilar in material, size, shape, and thickness. In some embodiments,the tiles 4002 a and 4002 b may have different material, size, shape, orthickness. For example, the tile 4002 a may be thicker than the tile4002 b. As another example, the tile 4002 a may be a different material(e.g. different model of tile, different make of tile, etc.) than thetile 4002 b.

In some embodiments, the stabilizer 4004 may be generally similar to thestabilizers described herein (e.g. stabilizer 104).

The tile assembly 4000 depicted in FIG. 40 does not have a stabilizerconnected to the bottom surface of the tile 4002 b. In some embodiments,a stabilizer, similar to stabilizer 104, may be connected to the bottomsurface of the tile 4002 b. In some embodiments, the tile 4002 b mayfunction as the stabilizer 104. For example, the stabilizer 4004 betweenthe tiles 4002 a and 4002 b may be fiberglass, and the stabilizerconnected to the bottom surface of the tile 4002 b may be a polymer,such as polyethylene terephthalate (PET). In some embodiments, astabilizer 4004 is not present. That is, the tile assembly may, in someembodiments, include tiles 4002 a, 4002 b and attachment features 4006,without stabilizer 4004. In some embodiments, the tile assembly may notinclude attachment features. That is, is some embodiments, the tileassembly includes tiles 4002 a, 4002 b separated by stabilizer 4004.

In some embodiments, attachment feature 4006 may be generally similar toattachment features described herein (e.g. attachment feature 106). Forexample, the attachment feature 4006 may have a click-lock feature ormay have a tongue or groove feature to correspond with the attachmentfeature 4006 of another tile assembly 4000. In some embodiments, theattachment feature 4006 may be connected to the tiles 4002 a or 4002 b,connected to the stabilizer 4004, connected to the bottom of the tile4002 b, or a combination thereof. The attachment feature 4006 may beconnected to the edge of the tiles 4002 a or 4002 b, or may be connectedto the edge of the tiles 4002 a or 4002 b and the bottom of the tile4002 b.

In some embodiments, the attachment feature 4006 may be manufacturedusing moulding extrusion, 3-D printing, and the like. In someembodiments, the attachment feature 4006 may be connected to the tile4002 a, tile 4002 b, or stabilizer 4004, for example, by gluing,moulding, or bonding.

In some embodiments, the thickness of the tile assembly 4000 may beapproximately 8 mm. The tile 4000 a may be approximately 4 mm and thetile 4000 b may be approximately 4 mm. The tiles 4000 a and 4000 b mayhave different thicknesses.

In some embodiments, the tile assembly 4000 may be waterproof or may betreated with a material so it may be water proof. In some embodiments,the tile assembly 4000 may be installed on a wall, for example in ashower stall, to protect the wall from liquids.

FIG. 41 is a schematic of two tile assemblies 4000 a and 4000 b havingtwo tiles 4002 a and 4002 b connected together. The stabilizer 4004 maybe fibre glass, metal (e.g. steel or aluminum), polymer, or anothermaterial. As depicted in FIG. 41 , both tiles 4002 a and 4002 b havechamfered edges that form an irregular shape when joined together. Insome embodiments, the attachment feature 4006 may be a single componentthat joins the two tile assemblies 4000 a and 4000 b together. Theattachment feature 4006 may be configured to have a shape and designsuch that it may contact the two tile assemblies 4000 a and 4000 b andconnect with the two tile assemblies 4000 a and 4000 b.

In some embodiments, the attachment feature 4006 may be pre-fabricated.In some embodiments, the attachment feature 4006 may be liquid or partlyliquid and may be applied on site.

In some embodiments, to manufacture the tile assembly 4000, each tile4000 a and 4000 b may be manufactured separately. For example, each tile4000 a and 4000 b may be cut from material and machined or moulded tohave the desired shape, dimensions, edge design, finish, etc. After thetiles 4000 a and 4000 b have been manufactured, then they may beattached together using a stabilizer 4004, such as fibre glass, metal,polymer, foam, or adhesive.

FIG. 42 is two exploded views of a tile assembly 4000 having two tiles4000 a and 4000 b.

FIG. 43 is a schematic of two tile assemblies 4000 a and 4000 b eachhaving two tiles 4002, with stabilizers 4004 joined to the two tiles. Asdepicted in FIG. 43 , the tile assembly 4000 a has a backing 4008 a, andthe tile assembly 4000 b has a backing 4008 b. The backing 4008 may bemade with foam, loops, or polymer. Where the tile assembly 4000 is to beinstalled on a floor, the backing material 4008 may be foam. Where thetile assembly 4000 is to be installed on a wall, the backing material4008 may have a material for mounting or connecting the tile assembly4000 to the wall, such as loops. The backing material 4008 may besufficiently suitable to withstand high stress applied to the tileassembly 4000 (e.g. from a focused point like the heel of a stiletto).The backing material 4008 may be reinforced with fibre glass. In someembodiments, the backing material 4008 may be a second stabilizersimilar to the stabilizers described herein (e.g. stabilizer 104,stabilizer 4004).

FIG. 44 is a schematic of a tile system 4450 having nine tilingassemblies 4000 a-4000 i connected together. In some embodiments, when atiling assembly is connected with another tiling assembly to form a tilesystem, the top surface of the tiling assemblies may be approximatelylevel.

FIG. 45 is a schematic of two tile assemblies 4000 a and 4000 b havingtwo tiles 4002, with a loop backing 4008 a and 4008 b connected to thetile assemblies 4000 a and 4000 b. The tile assemblies 4000 a and 4000 bhaving the loop backing 4008 a and 4008 b may be connected to a surfacehaving corresponding hooks that may engage with the loops of the loopbacking 4008 a and 4008 b.

In some embodiments, the bottom surface of the second tile 4002 b may bea coupling surface for releasably mounting the tile assembly 4000 toanother coupling surface that is complementary to coupling surface ofthe tile. The coupling surface of the second tile 4002 b may be hooks orloops, and the another coupling surface may be the other of hooks orloops.

In some embodiments, the tile assembly 4000 may be designed withtolerances for installation. For example, there may be gaps in lockinglaps to determine forgiveness, such as when sliding vertically orhorizontally.

In some embodiments, the tile assembly 4000 may be cut on site. The tileassembly 4000 may be scored or cut, for example, with a wet saw.

FIGS. 46-65 depict the manufacturing of a tile assembly 100 with a tile102. In some embodiments, the manufacturing of a tile 100 may be adaptedto manufacturing of a tile assembly 4000 having two tiles 4002 a and4000 b.

In some embodiments, the tile assemblies may be manufactured by moulding(e.g. back moulding) the tile with the stabilizer 104 or attachmentfeature 106. The stabilizer 104 and attachment feature 106 may beintegrally formed or may be separate components.

The tile assemblies may be manufactured in a way to reduce vulnerabilityto cracking, improved ease of installation, improved quality ofinstallation, and improved ease of replacement of damaged tiles.

In some embodiments, the tile assembly may be manufactured by backmoulding of tiles 102 and installation with the attachment feature 106,by moulding the attachment feature 106 to the tile 102, by an injectionmoulding process, or by a variotherm process. Different sizes of tiles102 may be moulded.

After the part has solidified in the manufacturing tool, the part may beejected. Suction cups may hold tiles 102 in place prior to moulding.There may be a resilient surface on the side where the tile 102 sits.There may be a sealing element made out of partly resilient material toseal off plastic.

FIG. 46 is a schematic of a tile assembly 100 manufactured with thestabilizer 104 and attachment feature 106 moulded to a tile 102.

FIG. 47 is a schematic of a tile assembly manufacturing tool 4700.

FIG. 48 is another schematic of the tile assembly manufacturing tool4700 with the tool support 4702 separate from the resilient layer 4704.

FIG. 49 is a schematic of a tile assembly 100 being manufactured by themanufacturing tool 4700. The manufacturing tool 4700 may comprise a toolsupport 4702 for supporting a tool 4708 that may closely contour withthe tile assembly and that may be cooled or may be heated. The tool 4700may also comprise the resilient layer 4704 for protecting the tile 102from breaking during the manufacturing process. The manufacturing tool4700 may comprise a sealing frame and seal 4706 to seal off the materialand maintain the shape of the tile assembly 100 during manufacturing. Asdepicted in FIG. 49 , the tile 102 is being connected to a stabilizer104. In some embodiments, the stabilizer 104 may comprise the attachmentfeature 106.

FIG. 50 is a schematic of a temperature plot of the plastic and themanufacturing tool 4700 during the tile assembly manufacturing processperformed by the manufacturing tool 4700. The temperatures of theplastic and tool may be example temperatures. As depicted, thetemperature of the plastic increases at the injection point, and slowlydecreases until the part is ejected.

In some embodiments, a polymer used for the tile assembly 100 may bePET, recycled PET (rPET), polypropylene (PP), polyethylene (PE),acrylonitrile butadiene styrene (ABS),Acrylnitril-Styrol-Acrylat-Copolymere (ASA), fillers, a foam material,or a combination thereof.

In some embodiments, the tile assembly 100 may be manufactured bypress-welding. The backing plate of the tile assembly 100 (e.g. thestabilizer) may be moulded, including the attachment feature 106 (e.g.tongue and groove). The tile 102, which may be a ceramic tile, may beheated. Then, the backing plate and the tile 102 may be press-welded ina separate tool.

FIG. 51 is a schematic of a moulding backing plate for manufacturing atile assembly 100. The back plate (e.g. stabilizer 104) may include theattachment feature 106. As depicted in FIG. 51 , the back plate may havea recess for receiving the tile 102 of the tile assembly 100.

FIG. 52 is a schematic of a tile 102 for manufacturing a tile assembly100. The tile may be heated during a press-welding process formanufacturing the tile assembly 100.

FIG. 53 is a schematic of press welding a tile 102 and a backing plate(e.g. a stabilizer 104, attachment feature 106, or both) formanufacturing a tile assembly 100. In some embodiments, each of the tile102 and the backing plate may be supported by a mould 5300 a and 5300 bwhile the tile 102 and the backing plate are pressed together.

FIG. 54 is a schematic of a manufactured tile assembly 100. FIG. 54depicts a tile assembly 100 comprising a tile 102, a stabilizer 104,male attachment feature 108 and female attachment feature 110.Additional tile assemblies 100 may be manufactured, and may be connectedtogether using the male attachment features 108 and female attachmentfeatures 110.

In some embodiments, a tile assembly 100 manufactured by a press-weldingprocess may be similar to a tile assembly 100 manufactured by aninjection back-moulded tile.

FIG. 55 is a table 5500 outlining features of an injection mouldingprocess, variotherm process, and press welding process. As depicted inthe table 5500, the injection moulding process, variotherm process, andpress welding process may be compared using cost of tools, cycle times,risk of tile breakage during process, development risk, and developmentcosts. Other metrics for comparing the processes may be possible.

Press-welding may provide a low investment cost solution that mayperform a serial process.

In some embodiments, the tile assemblies may be manufactured using acombination of an injection moulding process, variotherm process, andpress welding process.

Press-welding may have a relatively low risk of breakage of the tileduring manufacturing. The pressure applied to the tile may be relativelylow and may be controlled by temperature of the tile or the plasticparts (e.g. by pre-heating the plastic parts). For example, the pressurefor press welding may be approximately 1 bar, and the pressure forinjection moulding may be greater than 100 bar.

In addition, prototypes of the tile assembly may be close to the serialproduct.

In some embodiments, the press-welding concept may be injection mouldingof backing as a separate process. The welding may occur by heating thetile and pressing the tile against the plastic backing that sits in atool (to avoid expansion through the pressure).

The surface structure of the back of the tile may not matter during apress-welding process. There may be some design considerations for theplastic component to avoid air traps. The tile may be heated up quicklyas they have a very low thermal expansion, so the tile may not warp evenif heating is mainly happening on the surface of the tile.

In some embodiments, the polymer used for manufacturing the tileassembly may be a polylactic acid polymer (PLA) or PET, and the tile maybe 6″ or 8″ tiles.

FIG. 56 is a schematic of a tile 102 and a backing plate being presswelded together to form a tile assembly 100. FIG. 56 depicts amanufacturing tool 5600 pressing the tile 102 and the backing platetogether. The tool 5600 has an injection side 5602 and an ejection side5604. The tool 5600 may comprise a cold tool part 5606 for sealing thecomponents of the tile assembly 100 being manufactured to seal off thematerial and maintain the shape of the tile assembly 100 duringmanufacturing. The tool 5600 may comprise a hot tool part 5608 that maycontact the backing plate. The tool 5600 may comprise a resilient part5610 for avoiding breakage of tile 102. The tool 5600 may comprise anadditional seal 5612 to seal off the material and maintain the shape ofthe tile assembly 100 during manufacturing.

The tool 5600 may comprise plastics that may surround the tile 102 onits whole perimeter. There may be four cams on each side of the toolthat slide away to the outside. The cams may be cold whereas the toolitself may be hot. The cold cams may allow the material to freezequickly. There may be additional seal material on the cams to compensatefor uneven edges in the tiles.

FIG. 57 is a schematic of cams of a tile assembly manufacturing tool5600. As depicted in FIG. 57 , the cams 5614 a, 5614 b, 5614 c may slideaway, for example, at approximately 45°.

FIG. 58 is a schematic of an example embodiment of a press-welded tileassembly 100.

FIGS. 59-63 are schematics of example embodiments of attachment featuresof a press-welded tile assembly.

FIG. 59 depicts a tile assembly 100 with a tile 102, a stabilizer 104,and an attachment feature 106. As depicted in FIG. 59 , the polymerstabilizer 104 or attachment feature 106 may surround the tile 102.

FIG. 60 depicts a tile assembly 100 with a tile 102, a stabilizer 104,and an attachment feature 106. As depicted in FIG. 60 , the edge of thetile 102 may be curved.

In some embodiments, to avoid breakage of the tile 102 duringmanufacturing of the tile assembly 100, a resilient tool material may beprovided where the tile 102 meets the tool. There may be low pressuredue to the variotherm process, which may be due to slow filling withlittle pressure due to hot tool. There may be sufficient injectionpoints to further reduce pressure.

FIG. 61 depicts a tile assembly 100 with a tile 102, a stabilizer 104,and a female attachment feature 110. As depicted in FIG. 60 , the lengthof the female attachment feature 110 extending from the tile may be, forexample, 1900 mm.

FIG. 62 depicts a tile assembly 100 with a tile 102, a stabilizer 104,and a male attachment feature 108.

FIG. 63 depicts a tile assembly 100 with a tile 102, a stabilizer 104, amale attachment feature 108 and a female attachment feature 110.

FIG. 64 is a schematic of a press-welded tile assembly 100.

FIG. 65 depicts a tile assembly 100 with a tile 102, a stabilizer 104,and a female attachment feature 110. As depicted in FIG. 60 , the lengthof the female attachment feature 110 extending from the tile may be, forexample, 1900 mm.

In some embodiments, it may be possible to have multiple mouldsmanufacturing tile assemblies from a single press. It may also bepossible to do this on a lot to lot basis. For example, a certain numberof 12″ tiles may be moulded, and then some inserts in the tool may bechanged or process parameters may be changed to run the 18″ tile. Thismay be more efficient.

In some embodiments, the moulded polymer (e.g. moulded PET) of the tileassembly may be 2 mm thick. In some embodiments, the moulded polymer(e.g. moulded PET) of the tile assembly may be more than 2 mm thick(e.g. 4 mm thick).

In some embodiments, with a slider concept, the tongue and grooveattachment feature 106 may be relatively easy to manufacture and forproducing a tile assembly 100 with the tongue and groove attachmentfeature 106.

In some embodiments, for a female attachment feature 110, the depth ofthe groove may be variable. For example, the depth of the groove may be2 mm, or may be greater or less than 2 mm.

The tile assemblies discussed herein may be installed on a surface. Insome embodiments, to install the tile assembly on a surface, a mountassembly may be first installed on the surface, and the tile assemblymay then be connected to the mount assembly to install the tile assemblyto the surface.

FIG. 66 is a schematic of a mount assembly 6600.

The mount assembly 6600 may comprise a plate 6610. The tile assembliesmay be removably connected to the surface of the plate 6610. Forexample, the surface of the plate 6610 may have hooks to correspond toloops on the bottom surface of the tile assembly, such that the tileassembly may be connected to the plate 6610 and be removable from theplate 6610. As depicted in FIG. 66 , the plate 6610 has a generallyhexagonal shape. In some embodiments, the plate 6610 may have othershapes. For example, the plate 6610 may have a circle, triangle, square,rectangle, pentagon, heptagon, octagon, an irregular shape, shape withat least one curved side, and the like.

The plate 6610 may have one or more recesses 6612 for receiving ajoining component (e.g. a disc) for connecting the plate 6610 to otherplates 6610, or for connecting the plate 6610 to the surface under orbehind the plate 6610. As depicted in FIG. 66 , the plate 6610 has sixrecesses 6612. In some embodiments, the number of recesses 6612 maydepend on the configuration of the plate 6610 and how the plate 6610 isto be connected to the surface under or behind the plate 6610. Forexample, there may be a recess 6612 at each corner of the plate 6610.

The plate 6610 may have one or more channels 6614 for receiving aconnector (e.g. screw, plug, nail, etc.) for securing the plate 6610 tothe surface under or behind the plate 6610. The channel 6614 may extendthrough the plate 6610 between the top and bottom surface of the plate6610. The size of the channel 6614 may depend on the connector used forsecuring the plate 6610 to the surface under or behind the plate 6610.

The plate 6610 may have one or more corner channels 6616 for receiving aconnector (e.g. screw, plug, nail, etc.) for securing the plate 6610 tothe surface under or behind the plate 6610. The corner channel 6616 mayextend through the plate 6610 between the top and bottom surface of theplate 6610. The size of the channel 6616 may depend on the connectorused for securing the plate 6610 to the surface under or behind theplate 6610.

The dimensions and configurations of the plate 6610, and the locationand configurations of the recess 6612, the channel 6614, or the cornerchannel 6614 may be based on building supports of the surface on whichthe plate 6610 is to be connected. For example, the dimensions andconfigurations of the plate 6610, and the location and configurations ofthe recess 6612, the channel 6614, or the corner channel 6614 may bebased on stud spacing of a wall on which the plate 6610 is to beconnected. As another example, the dimensions and configurations of theplate 6610, and the location and configurations of the recess 6612, thechannel 6614, or the corner channel 6614 may be based on centre tocentre on studs of a wall on which the plate 6610 is to be connected.

The mount assembly 6600 may comprise a joining component 6620 forconnecting plates 6610 together and for connecting the plates 6610 tothe surface under or behind the plates 6610. As depicted in FIG. 66 ,the joining component 6620 is a circular disc. In some embodiments, thejoining component 6620 may be other shapes, such as triangle, square,rectangle, pentagon, heptagon, octagon, an irregular shape, shape withat least one curved side, and the like.

The joining component 6620 may be received in the recess 6612 of theplate 6610. When three plates 6610 are brought together, the joiningcomponent 6620 may be received in a circular recess 6613 defined by therecesses 6612 of the three plates 6610.

The thickness of the joining component 6620 may be such that when thejoining component 6620 is received in the recess 6612 of the plate 6610,the top surface of the joining component 6620 may be flush with the topsurface of the plate 6610.

The joining component 6620 may have a central channel 6622 and one ormore peripheral channels 6624 for receiving a connector (e.g. screw,plug, nail, etc.) for securing the plate 6610 and the joining component6620 to the surface under or behind the plate 6610. As depicted in FIG.66 , the joining component 6620 has three peripheral channels 6624 andone central channel 6622. The channels 6624 and 6622 may extend throughthe joining component 6620 between the top and bottom surface of thejoining component 6620. The size of the central channel 6622 andperipheral channel 6624 may depend on the connector used for securingthe plate 6610 and joining component 6620 to the surface under or behindthe plate 6610.

In some embodiments, the feature of the top surface of the plate 6610that connects with the tile assemblies may also be on the top surface ofthe joining component 6620.

To secure the plate 6610 and the joining component 6620 to a surface,the plates 6610 may be brought together (e.g. brought together at acorner) to define a recess 6613 for receiving the joining component6620. The joining component 6620 may be received in the recess 6612 orrecess 6613. The central channel 6622 may be aligned with the cornerchannels 6616 of the plates 6610 (which, when the plates 6610 arebrought together, the corner channels 6616 of the plate may togetherdefine a channel 6618) and the peripheral channels 6624 may be alignedwith the channels 6614 of the plates 6610. Then, connectors may beinserted through the central channel 6622 of the joining component 6620,the corner channels 6616 of the plate 6610 defining the channel 6618,the peripheral channels 6624 of the joining component 6620, or thechannels 6614 of the plate 6610 to connect the plates 6610 and thejoining component 6620 to the surface under or behind the plate 6610.

In some embodiments, the plate 6610 may be hook plate, where the plate6610 may have one or more hooks on the surface of the plate 6610 forconnecting with a tile assembly.

In some embodiments, the plate 6610 or joining component 6620 may bemanufactured using a process with low investment cots. For example, theplate 6610 or joining component 6620 may be manufactured using moulding,welding, machining, 3-D printing, and the like.

3-D printing the plate 6610 or joining component 6620 may be beneficial.There may be potential ability to manufacture the hooks on the surfaceof the plate 6610 or joining component 6620. It may be possible todirectly print hooks. The hooks may have various and different shapesand may be optimized.

The technology may be scalable using relatively cheap components. Theprocess may be used for mass production. For examples, a plurality ofnozzles side my side may extrude the hooks.

3D-printing may allow the plate 6610 or joining component 6620 to have ahollow inner structure, which may allow for thicker plate 6610 orjoining component 6620 without sacrificing weight. In addition, if theplate 6610 or joining component 6620 has a hollow inner structure, itmay be easy to cut the plate 6610 or joining component 6620 at apreferable direction.

When 3-D printing the plate 6610 or joining component 6620, their shapeand dimensions and configurations may be customized.

In some embodiments, the plate 6610 or joining component 6620 or tileassemblies described herein may be customized. A room may be scannedwith a laser-supported 3D camera to get the measurements of the room.The plate 6610 or joining component 6620 or tile assemblies may begenerated automatically so on-site adaptation or cutting may not berequired.

The mount assembly 6600 may be connectable with a tile assembly. Theloops of the tile assembly may be attached to the bottom surface of thetile assembly, such as the bottom surface of the tile assembly, or thestabilizer, or a foam backing.

In some embodiments, the plate 6610 may have an expansion joint in theconfines of the plate 6610.

The mount assembly 6600 may be configured to be relatively universallyapplicable to various surfaces.

The plate 6610 or the joining component 66220 may be hollow, haverecesses, or have channels extending through to reduce weight.

In some embodiments, the exterior of the plate 6610 or joining component6620 may appear the same, and the interior of the plate 6610 or joiningcomponent 6620 may be changed for a specific use.

In some embodiments, the plate 6610 may be shaped like a square orhexagon.

The plate 6610 or joining component 6620 may be relatively flat.

In some embodiments, a plate 6610 with all hooks may be required forcommercial use for vinyl.

In some embodiments, a thin surface veneer may go into mould backed withplastic.

The mount assembly 6600 may be designed with tolerances forinstallation.

In some embodiments, the raw material for the plate 6610 or joiningcomponent 6620 may be a low cost or lowest cost option material. Forexample, PET may be used to manufacture the plate 6610 or joiningcomponent 6620. In some embodiments, additives or filler may be used tooptimize features.

In some embodiments, the plate 6610 may be hexagon shape.

In some embodiments, the maximum width or length of the plate 6610 maybe 2 feet.

In some embodiments, the maximum thickness of the plate 6610 may be ⅛″or wider to allow for inserts on the side of the plate 6610, such asflanges, tongue and groove, etc.

In some embodiments, the weight of the mount assembly 6600 may be aslight as possible while maintaining stability or rigidity optimization.For example, the weight may be 0.4416 pounds or kilograms per squarefoot.

In some embodiments, on the back of the plate 6610, there may be cutouts for weight optimization. The design of the plate 6610 may consider“coining” and whether flatness may be necessary.

In some embodiments, the connector or fastener for fastening the plate6610 or joining component 6620 to the surface under or behind the plate6610 may be screw sights. Where the plate 6610 has a hexagon shape, thecorner of 3 plates may come together. In some embodiments, washers maybe needed. In some embodiments, other design features may be needed. Insome embodiments, the corner of the plate 6610 may have a recess ordouble recess. In some embodiments, a full cap may be used.

In some embodiments, there may be attachment features for connectingplates 6610 together. The attachment features may be similar toattachment features described herein for tile assemblies. In someembodiments, the attachment features may be tongue and groove, or slots,for positioning and versatility. In some embodiments, there may betongue and groove flanges at corners and flat surface to surface.

In some embodiments, the joint between plates 6610 may have no space forexpansion or contraction. Instead, if required, cut outs as series ofholes throughout the plate 6610 may be considered to accommodateexpansion or contraction.

In some embodiments, a plate 6610 for mounting to a wall may havedifferent connections with another plate 6610 than a plate 6610 forinstalling on a floor.

In some embodiments, the wall plate design and floor plate design may beeffectively one mound with same or consistent features.

In some embodiments, the plate 6610 may have additional provision forone or more tongue and groove attachment features on all sides of theplate 6610 for waterproof installation. In some embodiments, flanges forside to side attachment may include features for click-lock, snapping,or male and female connections. In some embodiments, the joint betweenplates 6610 may be tight so as to reduce or eliminate any telegraphy.This may lead to expansion or contraction. Expansion or contraction maybe resolved by “acclimatization” or holes with or recesses in or on theplates 6610.

The attachment feature of the plate 6610 may be a slot without two sideswith tongue and groove.

In some embodiments, the mount assembly 6600 may be a resilient mountassembly comprising adhesive plates and discs. The mount assembly 6600may be made with vinly composition tile (VCT), luxury vinyl tile (LVT),marmoleum, rubber, a polymer, or the like. The materials may be sheets.

In some embodiments, the mount assembly 6600 may have a hard surface,such that the mount assembly 6600 comprises hook and loop plates anddiscs. The mount assembly 6600 may be made with ceramic, porcelain,granite, marble, stone, and the like.

In some embodiments, the mount assembly 6600 may have a soft surface,such that the mount assembly 6600 comprises hook and loop plates anddiscs. The mount assembly 6600 may be made with carpet, wide widthcarpet, or carpet tiles.

In some embodiments, the plate 6610 or joining component 6620 may haveraised areas for reducing contact area with adhesive backed surfaces.

In some embodiments, the joining component 6620 may be designed to alsoform raised areas for reduction or elimination of telegraphy.

In some embodiments, the joints where plates 6610 meet may be designedto reduce or eliminate gap to mitigate or avoid cracking and telegraphy.

In some embodiments, the plate 6610 or joining component 6620 may bedesigned to also use a secondary process. The plate 6610 or joiningcomponent 6620 may be designed to avoid coining.

In some embodiments, the materials used for manufacturing the plate 6610or joining component 6620 may reduce cost of manufacturing the plate6610 or joining component 6620. The manufacturing of the plate 6610 orjoining component 6620 may include filler; recycled polymer, or polymer.

In some embodiments, the mount assembly 6600 may have no rib structure,a hexagonal structure, or a rectangular rib structure, or another kindof rib structure.

In some embodiments, the mount assembly 6600 may be installedvertically, horizontally, or a combination thereof.

In some embodiments, the joining component 6620 may have a certain sizeand certain functions, such as to manage a vertical load and belaterally flat.

FIG. 67 is a schematic of plates 6610 of mount assemblies 6600. FIG. 67depicts two plates 6610 having rib structures. In some embodiments, whena plate 6610 is to be installed on a wall, it may be easier to have ribstructures compared to a plate that is to be installed on a floor,because there may be less stress applied to the plate 6610 installed onthe wall.

In some embodiments, the rib structure of the plate 6610 may have astructure. As depicted in FIG. 67 , the plate 6610 may, for example,have a hexagon rib structure or rectangular rib structure. In someembodiments, having a rectangular rib structure may be beneficial forcutting the plate 6610.

FIG. 68 is a schematic of a mount assembly 6600 with plates 6610 joinedby joining components 6620. As depicted in FIG. 68 , the plates 6610 maybe installed horizontally on the surface with a bottom edge of theplates 6610 aligned generally horizontally, or the plates 6610 may beinstalled on the surface vertically or “on tip”, with a corner of theplates 6610 pointing downwards.

In some embodiments, it may be beneficial to install the plates 6610vertically or “on tip”. Vertical force may be carried by one attachmentpoint (e.g. by a joining component 6620) in the vertical direction.Further, during installation, the plate 6610 may be held in place by twojoining components 6620, which may stabilize the plate 6610 andfacilitate installation of the mount assembly 6600.

FIG. 69 is a schematic of mount assemblies 6600 with plates 6610installed horizontally and vertically. Where the plate 6610 is installedvertically, the direction of the force 6900 may be more clearly defined.Where the plate 6610 is installed horizontally, the force 6900 may tryto turn the plate 6610 or joining component 6620.

FIG. 70 is a schematic of mount assemblies 6600 with plates 6610installed horizontally and vertically. When the plates 6610 areinstalled vertically, they may be more stable, such as duringinstallation of the plates 6610.

FIG. 71 is a schematic of a plate of a mount assembly 6600. As depictedin FIG. 71 , when installing the mount assembly 6600, the plates 6610are connected together with a joining component 6620. FIG. 71 depictsthe recess 6613 defined by the recesses 6612 of a plurality of plates6610 brought together for receiving the joining component 6620. FIG. 71depicts the channel 6618 defined by the corner channels 6616 of aplurality of plates 6610 brought together for receiving a connector toconnect the mount assembly 6600 to a surface.

The joining component 6620 may be circular in shape, as depicted in FIG.71 . The joining component 6620 may be a disc. The joining component6620 may mount the plates 6610 to a surface, transfer vertical load, orbring lateral flatness to the plates 6610. The size of the joiningcomponent 6620 may be such that it may connect with the plates 6610.

FIG. 72 is a schematic of a joining component 6620 of the mount assembly6600. In some embodiments, the joining component 6620 may comprise aplug 7200 for connecting with the plate 6610 or mounting the mountassembly 6600 to a surface. In some embodiments, the plug 7200 may bereceived in the channel 6614 or the corner channel 6616 of the plate6610.

FIGS. 73-74 is a schematic of a joining component 6620 of the mountassembly 6600. In some embodiments, as depicted in FIG. 73 , the joiningcomponent 6620 may comprise an engaging hook 7300 for engaging with theplate 6610 or mounting the mount assembly 6600 to a surface. The plate6610 may have a gap 7310 for receiving the engaging hook 7300 forconnecting the joining component 6620 and the plate 6610. The hook 7300may snap engage with the gap 7310. The hook 7300 may receive the forceapplied to the mount assembly 6600 in this direction.

As depicted in FIG. 74 , when the hook 7300 is received in the gap 7310,the hook 7300 and the gap 7310 may be configured such that the joiningcomponent 6620 may be twisted to connect with the plate 6610. In someembodiments, there may be a locking feature 7400 between the plate 6610and the joining component 6620 for promoting connection between theplate 6610 and the joining component 6620.

FIG. 75 is a schematic of a joining component 6620 of the mount assembly6600. As depicted in FIG. 75 , the joining component 6620 is connectingplates 6610 together. The joining component 6620 as depicted in FIG. 75may comprise a barb 7510 on a top portion 7520 of the joining component6620. The joining component 6620 as depicted in FIG. 75 may comprise abottom portion joined to the top portion by a column 7540. In someembodiments, the plate 6610 may have a corresponding recess 7515 forreceiving the barb 7510 of the joining component 6620. The plate 6610 orthe joining component 6620 may be configured such that the plate 6610,joining component 6620, the barb 7515, or a combination thereof, mayelastically deform when the plate 6610 and the joining component 6620are connected together by receiving the barb 7510 in the recess 7515.The plate 6610, joining component 6620, the barb 7515, or a combinationthereof may return to its original shape after the barb 7510 is receivedin the recess 7515.

In some embodiments, the edge of the plate 6610 may be a barb or act asa barb when being inserted in a recess defined between the top portion7520 and bottom portion 7530 of the joining component 6620.

As depicted in FIG. 75 , the plate 6610 may be supported between the topportion 7520 and the bottom portion of the 7530 of the joining component6620.

In some embodiments, the joining component 6620 may have a channelextending through the column 7540 to receive a connector (e.g. nail,screw, plug, etc.) for connecting the plate 6610 and the joiningcomponent 6620 to a surface. In some embodiments, the joining component6620 may be made of a material such that a connector may be driventhrough the column 7540 for connecting the plate 6610 and the joiningcomponent 6620 to a surface.

FIG. 76 is a schematic of a mount assembly 6600 with the plates 6610 andjoining components 6620 assembled together.

FIG. 77 is a schematic of a mount assembly 6600 with gaps 7700 on theplates 6610. The gaps 7700 may allow the plates 6610 to be cut prior toinstallation.

FIG. 78 is a schematic of a mount assembly 6600. As depicted in FIG. 78, the mount assembly 6600 may be secured to a surface without everyrecess 6613 receiving a joining component 6620. The connection betweenthe mount assembly 6600 and the surface may be sufficiently strong suchthat the mount assembly 6600 may be secured to the surface without everyrecess 6613 receiving a joining component 6620 and connected to thesurface at that point.

FIG. 79 is a schematic of a mount assembly 6600. Plates 6610 may bebrought together, such that the recesses 6612 define a recess 6613. Thejoining component 6620 may be received in the recess 6613. In someembodiments, a screw may be received in the central channel 6622 of thejoining component 6620 to connect the plates 6610 and joining component6620 to a surface. In some embodiments, a screw may be received in theperipheral channel 6624 of the joining component 6620 to connect theplates 6610 with the joining component 6620, or to connect the plates6610 and the joining component 6620 to a surface.

FIG. 80 is a schematic of a mount assembly 6600. As depicted in FIG. 80, the joining component 6620 may be received in a recess 6612 of theplate 6610. A screw may connect the plate 6610 and the joining component6620 together. The screw may be received in the corner channel 6616. Ascrew may be received in the channel 6614 to secure the plate 6610 to asurface. Other connectors may be used. In some embodiments, when thecentral channel 6622 of the joining component 6620 is aligned with thecorner channel 6616 of the plate 6610 (or channel 6618 defined by plates6610 brought together), a connector may connect the plate 6610 andjoining component 6620 together. In some embodiments, when the centralchannel 6622 of the joining component 6620 is aligned with the cornerchannel 6616 of the plate 6610 (or channel 6618 defined by plates 6610brought together), a connector may connect the plate 6610 and joiningcomponent 6620 together and connect the plate 6610 and joining component6620 to a surface.

In some embodiments, with the channel 6614 of the plate 6610 alignedwith the peripheral channel 6624 of the joining component 6620, aconnector may connect the plate 6610 and joining component 6620together. In some embodiments, with the channel 6614 of the plate 6610aligned with the peripheral channel 6624 of the joining component 6620,a connector may connect the plate 6610 and joining component 6620together and connect the plate 6610 and joining component 6620 to asurface.

In some embodiments, the recess 6612 may be at a corner of the plate6610. In some embodiments, the recess 6612 may be at a side of the plate6610.

FIG. 81 is a schematic of a mount assembly 6600 being assembled. Asdepicted, a first row 8110 is installed on a surface, then a second row8120 is installed on the surface. In some embodiments, the rows may beinstalled from the bottom-most row first, then rows are installedupwards. In some embodiments, a first row may be installed, then asecond row may be installed relative to the first row.

FIG. 82 is a schematic of a mount assembly 6600 being assembled. Asdepicted, a first row 8210 is installed on a surface, then a second row8220 is installed on the surface, then a third row 8230 is installed onthe surface. The tiles may be cut to accommodate the surface. Forexample, if the first row 8210 is installed on a wall, the tiles of thefirst row 8210 may be cut such that the bottom of the tiles may be flushwith the floor that is connected to the tile.

FIG. 83 is a schematic of a corner of a plate 6610 of a mount assembly6600. As depicted in FIG. 83 , the recess 6612 of the plate 6610 has aslot 8300 extending through the recess 6612. The slot 8300 may beconfigured to receive a connector for connecting the plate 6610 to asurface, or may be configured to receive a corresponding feature on ajoining component 6620 to connect the plate 6610 to the joiningcomponent 6620.

FIG. 84 is a schematic of a corner of a plate 6610 of a mount assembly6600. As depicted in FIG. 84 , the recess 6612 of the plate 6610 has aslot 8300 extending through the recess 6612. The slot 8300 may beconfigured to receive a connector for connecting the plate 6610 to asurface, or may be configured to receive a corresponding feature on ajoining component 6620 to connect the plate 6610 to the joiningcomponent 6620. In some embodiments, the plate 6610 may have a grid orrib feature 8400 on it.

FIG. 85 is a schematic of a plate 6610 of a mount assembly 6600. Asdepicted in FIG. 85 , the corners of the plate 6610 may be generallysimilar. For example, each of the corners of the plate 6610 as depictedin FIG. 85 may comprise the slot 8300. The plate 6610 depicted in FIG.85 may have a grid or rib feature 8400.

FIG. 86 is a schematic of a mount assembly 6600 having anotherattachment feature. As depicted in FIG. 86 , the plate 6610 may comprisea tongue 8400 for connecting with a corresponding groove 8410 of anotherplate 6610 to connect the two plates 6610. In some embodiments, theplate 6610 may comprise a groove 8410. The groove 8410 may be offset topromote manufacturing or moldability. Accordingly, the plates 6610having a tongue 8400 or groove 8410 may connect to each other using thetongue 8400 and groove 8410.

In some embodiments, the connectors for connecting the plate 6610 to thejoining component 6620, or for connecting the plate 6610 and the joiningcomponent 6620 to a surface, may be a nail, screw, plug, anotherfastener, and the like.

In some embodiments, the length of a plate 6610 measured between twoopposite corners may be 2 feet.

In some embodiments, there may be a gap between hook areas forconnecting plates 6610 together, or for connecting plates 6610 to asurface.

In some embodiments, the plate 6610 and joining component 6620 may bemade with a material or dimensioned such that it was reduce sound orimprove sound proofing of a room.

In some embodiments, the surface on which the mount assembly 6600 isinstalled may be a floor or a wall. In some embodiments, the surface maybe wood, tile, carpet, foam, drywall, brick, concrete, and the like.

FIG. 87 is a schematic of a plurality of plates 6610 and joiningcomponents 6620 of a mount assembly 6600. The mount assembly 6600 may beconnected to a surface 8700.

FIGS. 88-92 are schematics of another attachment feature of a plate 6610of a mount assembly 6600.

FIG. 88 depicts a plate 6610 having tongues 8800 extending from thecorners of the plate. The tongues 8800 may be received by correspondinggrooves of another plate 6610. The tongue 8800 may be a protrusionextending from one or more sides of the plate 6610. As depicted in FIG.88 , the tongues 8800 have a shape generally similar to the sides of theplate 6610 from which the tongues 8800 extend. For example, as depictedin FIG. 88 , the tongues 8800 have an arrow shape that point outwardlyfrom the plate 6610. The tongue 8800 may have other shapes, such asshapes similar to attachment features described herein for tileassemblies.

In some embodiments, a tongue 8800 may extend from one or more than onecorner of the plate 6610. In some embodiments, a tongue 8800 may extendfrom one or more than one side of the plate 6610.

FIG. 89 depicts a plate 6610 having a tongue 8800 extending from acorner of the plate 6610. In some embodiments, the top surface of thetongue 8800 may be lower than the top surface of the plate 6610. In someembodiments, the bottom surface of the tongue 8800 may be higher thanthe bottom surface of the plate 6610.

In some embodiments, the tongue 8800 may be received in a groove havinga shape generally similar to the tongue 8800.

In some embodiments, the tongue may be a flange that connects a plate6610 to another plate 6610.

FIG. 90 depicts an example tongue 9000 of a tongue and grooveconnection. The tongue 9000 may be an attachment feature for tileassemblies or mount assemblies described herein. As depicted, an examplethickness of the tongue 9000 may be 1/16″. An example distance betweenthe top surface of the tile or plate and the top surface of the tongue9000 may be 1/32″. An example distance between the bottom surface of thetile or plate and the bottom surface of the tongue 9000 may be 1/32″. Anexample thickness of the tile or plate may be ⅛″. In some embodiments,the length of the tongue 9000 extending from the edge of the tile orplate may be such that the tongue and groove for a sufficient connectionto connect two tile assemblies together or two plates together.

FIG. 91 depicts an example tongue 9100. As depicted in FIG. 91 , thetongue 9100 may have a first portion 9110 and a second portion 9120 thatmay be offset from the first portion 9110. In some embodiments, thefirst portion 9110 and the second portion 9120 may not be offset, andmay be generally level and extend from a side of a tile or a plate.

FIG. 92 depicts a plate 6610 having tongues 9200 and grooves 9210 forreceiving the tongues 9210 from another plate 6610. As depicted in FIG.92 , the plate 6610 has three tongues 9200 and three grooves 9210. Thetongues 9200 may extend from three corners of the plate 6610, and thegrooves 9210 may extend into three corners of the plate. In someembodiments, the plate 6610 may have one or more tongues 9200 or one ormore grooves 9210. As depicted in FIG. 92 , the three tongues 9200 arenext to each other, and the three grooves 9210 are next to each other.In some embodiments, the tongues 9200 and grooves 9210 may be in otherpositions for connecting a plate 6610 to another plate 6610.

FIG. 93 is a schematic for assembling a mount assembly 6600. As depictedin FIG. 93 , each of the plates 6610 may have the same and properorientation. The plates 6610 may have tongues 9200 and grooves 9210 forconnecting with other plates 6610. As depicted in FIG. 93 , the tongues9200 and grooves 9210 may be at a side of the plate 6610. In someembodiments, the tongues 9200 and grooves 9210 may be at corners of theplate 6610. The plates 6610, in the same and proper orientation, may bejoined together such that the proper corners of the plates 6610 arebrought together, so the tongues and grooves of the plates 6610 may bealigned to connect the plates 6610 together.

FIG. 94 is a schematic for assembling a mount assembly 6600. As depictedin FIG. 94 , similar to FIG. 93 , each of the plates 6610 may have thesame and proper orientation. The plates 6610 may have tongues andgrooves for connecting with other plates 6610. The plates 6610, in thesame and proper orientation, may be joined together such that the propercorners of the plates 6610 are brought together, so the tongues andgrooves of the plates 6610 may be aligned to connect the plates 6610together.

As depicted in FIG. 94 , the plates 6610 may have tongues 9200 extendingfrom the side of the plate 6610 and also tongues 9200 extending from thecorners of the plate 6610. The plates 6610 may have grooves 9210 atcorners of plates 6610 for receiving the tongues 9200 extending from thecorners of the plates 6610.

FIG. 95 is a schematic for assembling a mount assembly 6600. As depictedin FIG. 95 , the plates 6610 may have tongues 9200 extending from thecorners of the plate 6610. The plates 6610 may have grooves 9210 atcorners of plates 6610 for receiving the tongues 9200 extending from thecorners of the plates 6610.

FIGS. 96-97 are schematics of a mount assembly having another attachmentfeature.

As depicted in FIG. 96 , the attachment feature may be a clip 9600. Asdepicted in FIG. 96 , a clip 9600 joins two plates 6610. In someembodiments, the clip 9600 may be separate from the plate 6610. That is,the clip 9600 may be a separate attachment feature. As depicted in FIG.96 , the ends of the clip 9600 may be angled, bevelled, chamfered, orotherwise shaped to be received in a corresponding recess 9610 of aplate 6610. The clip 9600 may be elastically deformable, such that, whenbeing inserted into the recess 9610, the clip 9600 may elasticallydeform to promote insertion into the recess 9610. After the clip 9600 isinserted into the recess 9610, the clip 9600 may return to its originalposition.

As depicted in FIG. 96 , the clip 9600 connects two plates 6610 alongthe sides of the plates 6610. In some embodiments, the clip 9600 mayjoin corners of plates 6610 together.

In some embodiments, the clip 9600 may comprise one or more prongs 9620for inserting the clip 9600 into the recess 9610. The clip 9600 depictedin FIG. 96 may comprise four prongs 9620. In some embodiments, a gap9630 may be defined between two prongs 9620 to promote elasticdeformation of the prongs 9620 when inserting the clip 9600 into therecess 9610.

In some embodiments, the clip 9600 may be integrally formed with orjoined to the plate 6610. As depicted in FIG. 97 , the clip 9600 isjoined to a side of the plate 6610. In some embodiments, the clip 9600may be joined to a corner of the plate 6610. The clip 9600 depicted inFIG. 97 has two prongs 9620 with a gap 9630 defined in between the twoprongs 9620.

FIG. 98 is a schematic of attachment features of mount assemblies 6600.In some embodiments, the attachment feature may be a series ofinterlocking pins 9810 for connecting plates 6610 together.

In some embodiments, the attachment features may be cooperativelyconfigured protrusions 9820 and recesses 9830 for receiving theprotrusions 9820 for connecting plates 6610 together. The protrusions9820 and recesses 9830 may be along the sides or edges of the plates6610, or may be along the top or bottom surfaces of the plates 6610.

FIG. 99 is a schematic of an attachment feature of mount assemblies6600. In some embodiments, the attachment feature may be a series ofinterlocking pins 9900 for connecting plates 6610 together. In someembodiments, the pins 9900 may be vertical hook pins. In someembodiments, the pins 9900 may be angular pins that may form a bridgeover a gap defined between two plates 6610.

FIG. 100 is a schematic for attachment features of a mount assembly. Insome embodiments, an adhesive sheet 10000 may be used to connect twoplates together 6610 or to connect a plate 6610 to a surface. Theadhesive sheet 10000 may have one or more protective covers on eitherside of the sheet 10000 that may be peeled off. The adhesive sheet 10000may be connected to a top surface, bottom surface, or side or edge ofthe plate 6610.

In some embodiments, the attachment feature may be a clip 10010. Theclip 10010 may be similar to clip 9600, except the clip 10010 may have alock mechanism 10020. The lock mechanism 10020 may have a defaultoutward position, as depicted in FIG. 100 (e.g. spring loaded outward).When the clip 10010 is being inserted into a recess, the recess may pushthe lock mechanism 10020 inward, allowing the clip 10010 to be insertedinto the recess. When the clip 10010 is received in the recess, the lockmechanism 10020 may extend outwards, thereby locking the clip 10010 inthe recess.

In some embodiments, the attachment feature may be a clip 10040. Theclip 10040 may be similar to the clip 9600. As depicted in FIG. 100 ,the clip 10040 may be dimensioned and shaped with angled sides topromote insertion into a recess 10030.

As depicted in FIG. 100 , the plates 6610 of a mount assembly 6600 maynot all be the same shape. For example, the plate 6610 a may have agenerally octagon shape, and the plate 6610 b may have a generallysquare shape. Plates 6610 a and plates 6610 b may be connected togetherto form a mount assembly 6600.

FIG. 101 is a schematic for attachment features of a mount assembly.

In some embodiments, the attachment feature may be a tongue 10110 andgroove 10120. In some embodiments, the thickness of the tongue 10110 andthe groove 10120 may be approximately 1/16″. In some embodiments, thedistance from the top surface of the plate 6610 to the top edge of thegroove 10120 may be approximately 1/32″. In some embodiments, thedistance from the bottom surface of the plate 6610 to the bottom edge ofthe groove 10120 may be approximately 1/32″.

In some embodiments, the attachment feature may be a clip 10130. Theclip 10130 may be similar to the clip 9600, except the clip 10130 mayhave flexible sides that may be inserted into a recess 10140. When beinginserted into the recess 10140, the flexible sides of the clip 10130 mayelastically deform until the clip 10130 is received in the recess 10140.Then, the clip 10130 returns to its original shape.

FIG. 102 is a schematic of another plate 6610 of the mount assembly6600.

In some embodiments, the plate 6610 may have opposing tongues or flanges10200 extending from opposing corners of the plate 6610. In someembodiments, the plate 6610 may have opposing tongues or flanges 10200extending from opposing sides of the plate 6610.

In some embodiments, the plate 6610 may comprise one or more throughholes or recesses 10210 for reducing the overall weight of the plate6610, or for reducing expansion or contraction of the plate 6610 (e.g.due to temperature). Through hole may extend through the plate 6610 fromthe top surface of the plate 6610 to the bottom surface of the plate6610. Recesses may be similar to through holes, but may not extendthrough the plate 6610. The recess may begin at the top surface or thebottom surface of the plate 6610.

In some embodiments, the joining component 6620 may have one or morethrough holes or recesses 10210.

FIG. 103 is a schematic of four plates 6610 of a mount assembly 6600connected by joining components 6620. As depicted in FIG. 103 , one ofthe plates 6610 has through holes or recesses 10210. The through holesor recesses 10210 may be circular, or may be another shape, such astriangle, square, rectangle, pentagon, hexagon, octagon, irregularshapes, and the like. The plate 6610 may have one or more through holesor recesses 10210. The number and size of through holes or recesses10210 may depend on the amount of weight of the plate 6610 to reduce,and how the expansion or contraction of the plate 6610 is to becontrolled.

The through holes or recesses 10210 may reduce weight of the plate 6610.For example, the through holes or recesses 10210 may reduceapproximately 30% weight of the plate 6610.

The through holes or recesses 10210 may reduce the contact area forsurface coverage. For example, the through holes or recesses 10210 mayreduce approximately 50% surface coverage.

The through holes or recesses 10210 may reduce contact area withoutincreasing possibility of telegraphing. The design of the through holesor recesses 10210 may avoid lineation or raised or recessed linealdirection.

The through holes or recesses 10210 may reduce the cost of materialsused to manufacture the plates 6610 and joining components 6620.

The through holes or recesses 10210 may create atmospheric stability soas to produce for the “closing” of gaps between the plates 6610 and thejoining components 6620.

In some embodiments, moulds (e.g. cavity moulds) for manufacturing theplates 6610 may be refurbished to manufacture plates 6610 if throughholes or recesses 10210.

In some embodiments, overlap may be rationalized and designed.

The through holes or recesses 10210 may lead to a cost savings whenmanufacturing the mount assembly 6600.

For example, the estimated weight of a mount assembly 6600 may beapproximately 4 pounds per square yard.

For an example calculation, the through holes or recesses 10210 mayreduce the weight of the mount assembly 6600 by approximately 30%.Accordingly, the weight reduction of the mount assembly 6600 withthrough holes or recesses 10210 may be 4 pounds per square yard×30%=1.2lbs reduction per square yard, leaving 2.8 pounds per square yard forbalance of weight.

For example, for cost reduction (and increase in base weight of plate ifneeded), filler may be used. For example, 30% filler may be used. 30%filler=30%×2.8 pounds per square yard=0.84 pounds per square yard.Estimating the cost of filler at 0.20 cents, then the cost offiller=0.84 pounds per square yard×0.20 cents per pound=0.168 cents persquare yard. The remaining weight of the mount assembly 6600 may be madeusing a polymer, such as recycled polymer. Estimating that the cost ofthe polymer is 0.45 cents per pound, then the cost of the polymer is1.96 pounds per square yard×0.45 cents per pound=0.882 cents per squareyard. Therefore; the estimated cost of the mount assembly 6600 withthrough holes or recesses 10210 may be 0.168 cents per square yard+0.882cents per square yard=1.05 cents per square yard=0.116 cents per squarefoot.

A mount assembly 6600 without through holes or recesses 10210 may costmore than a mount assembly 6600 with through holes or recesses 10210 asmore material needs to be used to manufacture the mount assembly 6600without through holes or recesses 10210.

The weight of the mount assembly 6600 may include additional thicknessfor joining the plates 6610 and the joining component 6620 to eliminatetelegraphy.

For an example calculation, the weight of the mount assembly 6600 may bebetween 4.75-5.33 pounds per square yard. Approximately 30% of thatweight may be reduced by through holes or recesses 10210. Of theremaining 70% weight, 30% may be filler (which may cost 0.20 cents perpound), and 70% may be recycled polymer (which may cost 0.40 cents perpound).

For the mount assembly 6600 weighing 4.75 pounds per square yardinitially, the weight reduction from the through holes or recesses 10210would be 4.75 pounds per square yard×30%=1.2 pounds per square yard, sothe weight of the mount assembly 6600 would be 2.8 pounds per squareyard. If 30% of this weight is filler, then the cost is 30%×2.8 poundsper square yard×0.20 cents per pound=0.168 cents per square yard. If 70%of this weight is recycled polymer, then the cost is 70%×2.8 pounds persquare yard×0.40 cents per pound=0.784 cents per square yard. The totalcost would be (0.168 cents per square yard+0.784 cents per squareyard)/9 square foot per square yard=0.105 cents per square foot.

A similar calculation may be done for the mount assembly 6600 weighing5.33 pounds per square yard initially. This would lead to a cost of 0.14cents per square foot.

FIG. 104 is a schematic of a plate 6610 of a mount assembly 6600 havingrecesses and through-holes 10210.

FIG. 105 is a schematic of plates 6610 of the mount assembly 6600. Asdepicted in FIG. 105 , plates 6610 may be an irregular shape, hexagon,square, or octagon. The plates 6610 may have another shape not depictedin FIG. 105 (e.g. triangle, pentagon, heptagon, circle, oval, polygon,etc.).

As depicted in FIG. 105 , plates 6610 of different shapes may be joinedtogether to form the mount assembly. In some embodiments, the plates6610 on the bottom row may be irregularly shaped to fit the edge of thesurface on which the plates 6610 are installed.

FIG. 106 is a schematic of mounting a mount assembly 6600 to a surface.

FIG. 107 is a schematic of mounting a mount assembly 6600 to a surface.In some embodiments, as depicted in FIG. 107 , the first plates 6610 andjoining components 6620 may be installed at the bottom of the surface,and then more plates 6610 and joining components 6620 may be used tobuild the mount assembly 6600 upwards.

FIG. 108 is a schematic of mounting a mount assembly 6600 to a surface.As depicted in FIG. 108 , there may be a sequence for installing theplates 6610. In some embodiments, the plates 6610 may be installed inrows. For example, as depicted in FIG. 108 , plates 6610 labelled with“1” may be installed first. Then, plates 6610 labelled with “2” may beinstalled second. Then, plates 6610 labelled with “3” may be installedthird, and so on. The joining components 6620 may be used to connectplates 6610 together or to connect the plates 6610 to the surface.

FIG. 109 is a schematic of mounting a mount assembly 6600 to a surface.As depicted in FIG. 109 , there may be a sequence for installing theplates 6610. In some embodiments, the plates 6610 may be installed inrows. For example, as depicted in FIG. 108 , plates 6610 labelled with“1A” may be installed first. Then, plates 6610 labelled with “1B” may beinstalled second. Then, plates 6610 labelled with “2” may be installedthird. Then, plates 6610 labelled with “3” may be installed fourth, andso on. The joining components 6620 may be used to connect plates 6610together or to connect the plates 6610 to the surface.

As depicted in FIG. 109 , the plates 6610 may have tongues 10810 andgrooves 10820 for aligning the plates 6610. The plates 6610 or joiningcomponents 6620 may be connected to the surface, for example, usingscrews or a double-sized adhesive.

The bottom most row of plates 6610 may be level of the edge of thesurface on which the mount assembly 6600 may be installed.

FIG. 110 is a schematic of mounting a tile system to a mount assembly6600. The tile system may be defined by tile assemblies 100 or 4000, asdescribed herein.

In some embodiments, the mount assembly 6600 has hooks on the topsurface of the mount assembly 6600. In some embodiments, the tile systemhas corresponding loops on the bottom surface. The tile system may bemounted to the mount assembly 6600 using the hooks and loops. In someembodiments, other mechanical connections may connect the tile system tothe mount assembly 6600.

FIG. 111 is a schematic of a wall 11100 for mounting the mount assembly6600. The wall 11100 may have corners and projecting walls.

In some embodiments, the mount assembly 6600 may be connected to a wall,and tile assemblies may be connected to the mount assembly 6600 usinghooks and loops. In some embodiments, the tile assembly may use 2.5 mmthick vinyl material. In some embodiments, the tile assembly or the tilesystem may be 1.22 m wide and 3.6 m high. The vinyl material may bepre-shaped on a thermal bending machine before being installed.

The tile assemblies, tile systems, and mount assembly described hereinmay be used in harsh environments. For example, the temperature may bebetween −25° C. to 60° C.

In some embodiments, the mount assembly may be secured to the surfaceusing screws.

Where hooks and loops may be used to connect the mount assembly to thetile systems, a portion of the bottom surface of the tile system mayhave hooks or loops, or a portion of the top surface of the mountassembly may have the other of hooks or loops.

In some embodiments, the plates 6610 or joining components 6620 may bemade with recycled PET. The thickness of the plates 6610 or joiningcomponents 6620 may be a minimum thickness that may allow the plates6610 or joining components 6620 to function.

By using recycled PET, expansion features may be removed as it is morestable regarding temperature.

FIG. 112 is a flow chart S11200 depicting a method for assembling andusing a tile system to cover a floor. The tile system may comprise twotiles stacked together with a reinforcing material therebetween.

In S11202, joining a first tile and second tile to reinforcing materialdisposed therebetween. The first tile may be stacked on the second tile.This may define a first tile assembly.

In S11204, similar to S11202, joining a first tile and a second tile toreinforcing material disposed therebetween. The first tile may bestacked on the second tile. This may define a second tile assembly.

In S11206, connecting the first tile assembly with the second tileassembly with a connector to define a tiling system. The connector mayhave a first component and a second component that is complementary tothe first component, wherein the first tile assembly has the firstcomponent and the second tile assembly has the second component.

In S11208, free floating the tile system on the floor. When the tilesystem is laid on the floor, the tile system may free float on thefloor. In some embodiments, the tile system may level itself based onthe texture or contours of the floor or surface on which the tile systemis laid on. In some embodiments, the tile system may be installed on topof an existing floor or substrate. In some embodiments, sand may be usedto partially level the existing floor or substrate when uneven. In someembodiments, the tile system may be installed on top of an existingfloor or substrate which is not level, without the use of any levellingmaterial between the existing floor/substrate and the tile system. Thatis, the tile system is installed in a “free floating” manner, unattachedto the existing floor or substrate below. Such a configuration may berelatively easy to remove when compared to tiling systems which requirethat the tiles be secured or fastened to the floor or substrate in somemanner.

FIG. 113 is a flow chart S11300 depicting a method for mounting a tilesystem to a surface using a mount assembly.

In S11302, installing plates and joining components on a surface. Thejoining components may join a plurality of plates together. The platesand joining components may be connected to the surface using fasteners,such as screws, nails, plugs, adhesive, and the like. In someembodiments, a bottom row of plates and joining components may beinstalled first. Then, more plates and joining components may be used toinstall more of the mount assembly upwards.

In S11304, joining a first tile and second tile to reinforcing materialdisposed therebetween. The first tile may be stacked on the second tile.This may define a first tile assembly.

In S11306, similar to S11304, joining a first tile and a second tile toreinforcing material disposed therebetween. The first tile may bestacked on the second tile. This may define a second tile assembly.

In S11308, connecting the first tile assembly with the second tileassembly with a connector to define a tiling system. The connector mayhave a first component and a second component that is complementary tothe first component, wherein the first tile assembly has the firstcomponent and the second tile assembly has the second component.

In S11310, connecting the tiling system with the mount assembly. Thetiling system and the mount assembly may be connected together usinghooks and loops. For example, a surface of the tiling system has hooksor loops, and a surface of the mount assembly has the other of hooks orloops. The surfaces of the tiling system and mount assembly having thehooks and loops may be joined together such that the hooks and loopsengage, and the tiling system connects with the mount assembly.

FIG. 114 is a schematic of telegraphing on a floor when using roll-outvinyl. In some embodiments, telegraphing may happen on roll-out vinyl.As depicted in FIG. 114 , the seams of hook plates may be seen. In someembodiments, the joining component may be seen. The vinyl may bestanding up on the seams defined between the plates. This may be causedbecause the hookless area on the edges of the hook plates plus theexpansion gaps, which may create a relatively large area where there areno hooks.

FIG. 115 is a schematic of a round object 11500 on a tile assembly 100.The force applied to the tile assembly, and the stress experienced bythe tile assembly, may be distributed over the tile assembly, which mayimprove the strength of the tile assembly.

FIG. 116 is a schematic of a corner of a tile.

FIG. 117 is a schematic of a tile assembly.

In some embodiments, tiles with a flat back and tiles for the supportback maybe used, and laminated with a suitable fibre fabric materialtherebetween.

In some embodiments, there may be air pockets between the two tiles of atile assembly having two tiles stacked above each other. The tileassembly may have a feature to reduce the amount of air pockets ormitigate formation of the air pockets between the two tiles.

In some embodiments, the material used to bond the tiles together of atwo-tile tile assembly may be particular to the types of tile used. Forexample, if Laminam® tiles are used, then bond used for bonding Laminam®tiles should be used. This allows appropriate transfer of stress throughthe tiles and through the reinforcing layer (e.g. fibre glass layer).

In some embodiments, one or more steps of the manufacturing process forthe tile assembly may be automated, for example, using a robot. Forexample, the pallet for the rolls and tiles, glue, and jig, may beautomated using a robot.

In some embodiments, the tile assemblies and mount assemblies describedherein may be tested using a Robinson test. A machine may apply a loadrepeatedly using a wheel, which may represent years of traffic. Duringthe testing, the tile assemblies and mount assemblies may be evaluatedfor cracking, attachment feature deterioration or grout deterioration,and degree of waterproofing.

In some embodiments, a machine for manufacturing the tile assembly maycomprise microles.

In some embodiments, the grout may be conventional grout. When repairingthe attachment feature or grout, a chisel or chop may be used in theaffected area and the grout may be removed. In some embodiments, thetile assemblies may still be connected together when the grout isapplied.

In some embodiments, a tile made with marble may be laminated to a tilemade with ceramic.

The tile assembly and mount assembly described herein may not requireextensive technical skills or experience to install. The parts may beeasy to assemble together and easy to install on the surface. The tileassembly and mount assembly may be installed on a surface without use ofa subsurface or support surface, such as mesh, beds, mortar, or grout.

As the tile assembly and mount assembly may be installed on a surfacewithout use of a subsurface or support surface, such as mesh, beds,mortar, or grout, inconveniences associated with using these subsurfacesor support surfaces may be avoid. For example, no mortar needs to bekept flat prior to installing a tile assembly or mount assembly on asurface.

As no mortar needs to be set or no grout finishing needs to be applied,time may be saved when installing the tile assembly or mount assembly toa surface.

In some embodiments, the reinforcing material between the two tiles of atile assembly may be changed based on the application of the tileassembly. As discussed herein, the reinforcing material may be fibreglass. In some embodiments, the reinforcing material may be Kevlar®.Accordingly, the tile assembly may have a military application.

In some embodiments, the tile assembly may be used on nautical crafts,such as boats or cruise ships, as a free floating and self-levellingflooring.

The tile system, comprising tile assemblies connected together, maylevel itself when installed on a floor. This may improve or promotewalking on the tile system.

In some embodiments, the tile assemblies may have sound proofing ornoise reduction capabilities.

In some embodiments, if grout is installed on the tile system having thetile assemblies, the tile system may prevent or reduce the frequency ofthe popping of the grout.

In some embodiments, the tile assembly and mount assembly may reducere-modelling costs. For example, if a floor laid with conventional tileis damaged, then the entire floor may have to be replaced. If the floorwas laid with the tile assemblies described herein, then only thedamaged tile assemblies may be replaced.

In some embodiments, holes may be cut in the tile assembly or mountassembly.

In some embodiments, marble or another top surface may be on thelaminate.

There may be a reduction in labour cost and reduction in skill cost asit may be relatively easy to use, assemble, or install the tile assemblyand the mount assembly.

In some embodiments, the systems and methods described herein may allowfor the pre-packaging of total floor areas and walls. For example, withconventional equipment (e.g. an application on a mobile computing devicethat might contain optical measurement devices), precise dimensions of awall, room or area thereof may be obtained quickly and withoutdifficulty. Alternatively, precise measurements may be provided by thecustomer or collected. Pictures may also be used to calculate roomdimensions. Using these dimensions, tiles may be pre-assembled andpre-cut by the manufacturer. These pre-assembled and pre-cut tiles canbe packaged for delivery and delivered for on-site installation. Ratherthan requiring the services of a skilled professional (who would have tomake decisions and cut tiles on-site), the systems, methods and productsdisclosed herein may allow for relatively simple installation of thepre-assembled tiles in free floating fashion. As such, significantsavings in labour may be obtained relative to conventional tilingsystems, which would require expert labour.

The tile assembly or mount assembly may present environmental benefits.During installation, no attachment cement or grout finishing may benecessary, which may reduce mess during installation of the tileassembly. As individual tile assemblies may be removed, little mess maybe created when uninstalling the tile assembly. The tile assemblies mayalso be uninstalled easily and reused. In some embodiments, using thetile assembly does not generate much dust or require additionaladhesives or materials to join the tile assembly together. When usingthe tile assembly, pre-working of the subsurface (e.g. applying mortaron floor, sanding down a wall, redoing a drywall, etc.) may not berequired.

The preceding discussion provides many example embodiments. Althougheach embodiment represents a single combination of inventive elements,other examples may include all suitable combinations of the disclosedelements. Thus if one embodiment comprises elements A, B, and C, and asecond embodiment comprises elements B and D, other remainingcombinations of A, B, C, or D, may also be used.

The term “connected” or “coupled to” may include both direct coupling(in which two elements that are coupled to each other contact eachother) and indirect coupling (in which at least one additional elementis located between the two elements).

Although the embodiments have been described in detail, it should beunderstood that various changes, substitutions and alterations can bemade herein.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized. Accordingly,the appended claims are intended to include within their scope suchprocesses, machines, manufacture, compositions of matter, means,methods, or steps.

As can be understood, the examples described above and illustrated areintended to be examples only. The invention is defined by the appendedclaims.

What is claimed is:
 1. A tile system for installation on a free floatingbasis to form a surface covering on a substrate without bonding the tileassembly to the substrate, the tile system comprising: a first tileassembly configured for connection to a second tile assembly, each ofthe first and second tile assemblies comprising: a first tile bonded toa layer of stabilizing material, the first tile being made from a stoneor ceramic material; wherein the first tile assembly further comprises afirst attachment component connected thereto and extending along a sidesurface of the first tile of the first tile assembly, the firstattachment component including a plurality of alternating magneticelements and polymer elements to define a first continuous attachmentsurface, and the second tile assembly further comprises a secondattachment component connected thereto and extending along a sidesurface of the first tile of the second tile assembly, the secondattachment component including a plurality of alternating magneticelements and polymer elements to define a second continuous attachmentsurface, the plurality of magnetic elements of the second tile assemblybeing complementary to the plurality of magnetic elements of the firstattachment component, the second attachment component beingcomplementary in shape to the first attachment component and configuredto receive the first attachment component to form a detachableconnection between the first tile assembly and the second tile assembly,the detachable connection having a magnetic force attracting the firstand second tile assemblies.
 2. The system of claim 1, wherein thedetachable connection between the first tile assembly and the secondtile assembly has a mechanical resistive force connecting the first andsecond tile assemblies.
 3. The system of claim 1, wherein the firstattachment component and the second attachment component are engaged ina friction fit when the first and second tile assemblies are connected.4. The system of claim 1, wherein the first attachment component is atongue and the second attachment component is a groove.
 5. The system ofclaim 1, wherein the connection between the first and second tileassembly is water resistant.
 6. The system of claim 1, the plurality ofmagnetic elements having a thickness that is less than the width andlength, having a width that is less than the length and more than thethickness, and having a length greater than the thickness and width, andbeing incrementally placed along the side surface of each of the firsttile.
 7. The system of claim 6, wherein at least one magnetic element ofthe plurality of magnetic elements is 1 mm thick, between 2 to 3 mmwide, and 10 mm long.
 8. The system of claim 6, wherein each magneticelement of the plurality of magnetic elements is incrementally placedapproximately every 3 to 4 inches along the side surface of each of thefirst tile.
 9. The system of claim 1, wherein the first tile is stackedon a second tile bonded to the layer of stabilizing material disposedbetween the first and second tiles.
 10. The system of claim 1, whereinan exposed surface of the first tile of the first tile assembly and anexposed surface of the first tile of the second tile assembly aresubstantially level.
 11. The system of claim 1, wherein the first tileassembly and second tile assembly define a gap therebetween.
 12. Thesystem of claim 11, wherein the gap is approximately 3/16″.
 13. Thesystem of claim 1, wherein the first and second attachment componentsextend from the side of each of the first tile by up to ⅜ of an inch andare recessed from a top surface of each of the first tile.
 14. Thesystem of claim 1, wherein the first and second attachment componentsare malleable.
 15. The system of claim 1, wherein the first and secondattachment components each include a microfeature such that the firstand second attachment components resemble traditional grout when thefirst and second tile assemblies are connected.